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Isola IS550H

Isola IS550H was developed in conjunction with a consortium of industry experts for high power & high voltage applications and PEV & HEV automotive electrification. The resulting solution addresses critical application needs for use in a harsh environment where very demanding, long term thermal reliability performance, extreme thermal cycling and very high voltage CAF & electro-migration resistance is required.

Functions: Laminate

Reinforcement Material: Glass Fibers

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Reinforcement Material
Composite Materials Functions

Features & Benefits

Labeling Claims
Ready-to-Use Product Features
Product Features

Industry Recognition

  • UL File Number: E41625
  • RoHS Compliant

Performance Attributes

  • CAF resistant
  • Low moisture absorption
  • Lead-free assembly compatible
  • Halogen free
  • 0.8 mm pitch capable
  • 6x 260°C reflow capable
  • 6x 288°C solder float capable

Product Attributes

  • Halogen Free
  • High Temperature
  • High Thermal Reliability

Applications & Uses

Typical Market Applications
  • Automative and Transportation
  • Aerospace and Defense

Properties

Flame Rating
Typical Properties
ValueUnitsTest Method / Conditions
Arc Resistancemin. 160SecondsIPC-TM-650
Comparative Tracking Index (CTI)3.0VoltsUL 746A ASTM D3638
Decomposition Temperature (Td) by TGA (5% weight loss)400.0°CIPC-TM-650
Dielectric Breakdown60.0kVIPC-TM-650
Dk, Loss Tangent(10 GHz)0.016IPC-TM-650
Dk, Loss Tangent(2 GHz)0.014IPC-TM-650
Dk, Loss Tangent(5 GHz)0.014IPC-TM-650
Dk, Permittivity(10 GHz)4.43IPC-TM-650
Dk, Permittivity(2 GHz)4.5IPC-TM-650
Dk, Permittivity(5 GHz)4.43IPC-TM-650
Electric Strength (Laminate & laminated prepreg)46.9 (1190)kV/mm (V/mil)IPC-TM-650
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Flexural Strength Cross direction50.8ksiIPC-TM-650
Flexural Strength Length direction60.9ksiIPC-TM-650
Glass Transition Temperature (Tg) by DSC200.0°CIPC-TM-650
Moisture Absorption0.25%IPC-TM-650
Peel Strength [125ºC (257ºF) (Standard profile copper)]1.35(7.6)N/mm (lb/inch)IPC-TM-650
Peel Strength After thermal stress (Standard profile copper)1.45 (8.2)N/mm (lb/inch)IPC-TM-650
Relative Thermal Index (RTI)150.0°CUL 796
Surface Resistivity (At elevated temperature)3.9 x 10^8IPC-TM-650
Surface Resistivity (C-96/35/90)1.0 x 10^8IPC-TM-650
Tensile Strength Cross direction27.0ksiASTM D3039
Tensile Strength Length direction31.0ksiASTM D3039
Thermal Conductivity0.7W/m·KASTM E1952
Thermal Stress Etched [10 sec, 288ºC (550.4ºF)]PassIPC-TM-650
Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)]PassIPC-TM-650
Time to Delaminate by T260 (Copper removed)min. 60MinutesIPC-TM-650
Time to Delaminate by T288 (Copper removed)min. 60MinutesIPC-TM-650
Volume Resistivity (At elevated temperature)3.2 x 10^8MΩ-cmIPC-TM-650
Volume Resistivity (C-96/35/90)5.2 x 10^7MΩ-cmIPC-TM-650
X/Y-Axis CTE Pre-Tg13-17ppm/°CIPC-TM-650
Z-Axis CTE 50 to 260°C, (Total Expansion)2.2%IPC-TM-650
Z-Axis CTE Post-Tg210.0ppm/°CIPC-TM-650
Z-Axis CTE Pre-Tg38.0ppm/°CIPC-TM-650

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Product Availability

Standard Material Offering: Laminate

  • 2 to 60 mil (0.05 to 1.5 mm)

Copper Foil Type

  • HTE Grade 3
  • RTF (Reverse Treat Foil)

Copper Weight

  • ½ to 2 oz (18 to 70 µm) available
  • Heavier copper available

Standard Material Offering: Prepreg

  • Tooling of prepreg panels
  • Moisture barrier packaging

Glass Fabric Availability

  • E-glass
  • Mechanically spread glass