Knowde Enhanced TDS
Identification & Functionality
- Composite Materials Functions
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
Industry Recognition
- UL File Number: E41625
- RoHS Compliant
Performance Attributes
- CAF resistant
- Low moisture absorption
- 0.8 mm pitch capable
- 6x 260°C reflow capable
- 6x 288°C solder float capable
Processing Advantages
- Multiple lamination cycles
- HDI technology compatible
Product Attributes
- High Density Interconnect
- High Speed Digital
- High Thermal Reliability
Applications & Uses
- Applications
- Composites End Use
Properties
- Flame Rating
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Arc Resistance | 125.0 | Seconds | IPC-TM-650 |
| Comparative Tracking Index (CTI) | 3.0 | Volts | ASTM D3638 |
| Decomposition Temperature (Td) by TGA (5% weight loss) | 360.0 | °C | IPC-TM-650 |
| Dielectric Breakdown | 60.0 | kV | IPC-TM-650 |
| Dk, Loss Tangent(10 GHz) | 0.0021 | — | IPC-TM-650 |
| Dk, Loss Tangent(2 GHz) | 0.0021 | — | IPC-TM-650 |
| Dk, Loss Tangent(5 GHz) | 0.0021 | — | IPC-TM-650 |
| Dk, Permittivity(10 GHz) | 3.02 | — | IPC-TM-650 |
| Dk, Permittivity(2 GHz) | 3.04 | — | IPC-TM-650 |
| Dk, Permittivity(5 GHz) | 3.02 | — | IPC-TM-650 |
| Electric Strength (Laminate & laminated prepreg) | 60 (1500) | kV/mm (V/mil) | IPC-TM-650 |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Flexural Strength Cross direction | 41.0 | ksi | IPC-TM-650 |
| Flexural Strength Length direction | 44.0 | ksi | IPC-TM-650 |
| Glass Transition Temperature by DMA | 220.0 | °C | IPC-TM-650 |
| Glass Transition Temperature by DSC | 200.0 | °C | IPC-TM-650 |
| Glass Transition Temperature by TMA | 180.0 | °C | IPC-TM-650 |
| Moisture Absorption | 0.1 | % | IPC-TM-650 |
| Peel Strength After thermal stress (Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]) | 0.79 (4.5) | N/mm (lb/inch) | IPC-TM-650 |
| Peel Strength After thermal stress (Standard profile copper) | 0.96 (5.5) | N/mm (lb/inch) | IPC-TM-650 |
| Poisson's Ratio Cross direction | 0.156 | — | ASTM D3039 |
| Poisson's Ratio Length direction | 0.165 | — | ASTM D3039 |
| Relative Thermal Index (RTI) | 130.0 | °C | UL 796 |
| Surface Resistivity (C-96/35/90) | 1.33 x 10^5 | MΩ | IPC-TM-650 |
| Taylor's Modulus Cross direction | 2197.0 | ksi | ASTM D790-15e2 |
| Taylor's Modulus Length direction | 2264.0 | ksi | ASTM D790-15e2 |
| Tensile Strength Cross direction | 25.0 | ksi | ASTM D3039 |
| Tensile Strength Length direction | 30.0 | ksi | ASTM D3039 |
| Thermal Conductivity | 0.42 | W/m·K | ASTM E1952 |
| Thermal Stress Etched [10 sec, 288ºC (550.4ºF)] | Pass | — | IPC-TM-650 |
| Thermal Stress Unetched [10 sec, 288ºC (550.4ºF)] | Pass | — | IPC-TM-650 |
| Time to Delaminate by T260 (Copper removed) | min. 60 | Minutes | IPC-TM-650 |
| Time to Delaminate by T288 (Copper removed) | min. 60 | Minutes | IPC-TM-650 |
| Time to Delaminate by T300 (Copper removed) | min. 20 | Minutes | IPC-TM-650 |
| Volume Resistivity (C-96/35/90) | 1.33 x 10^7 | MΩ-cm | IPC-TM-650 |
| X/Y-Axis CTE Pre-Tg | 15.0 | ppm/°C | IPC-TM-650 |
| Young's Modulus Cross direction | 2417.0 | ksi | ASTM D790-15e2 |
| Young's Modulus Length direction | 2551.0 | ksi | ASTM D790-15e2 |
| Z-Axis CTE 50 to 260°C, (Total Expansion) | 2.5 | % | IPC-TM-650 |
| Z-Axis CTE Post-Tg | 250.0 | ppm/°C | IPC-TM-650 |
| Z-Axis CTE Pre-Tg | 45.0 | ppm/°C | IPC-TM-650 |
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Product Availability
Standard Material Offering: Laminate
- 2 to 18 mil (0.05 to 0.46 mm)
Copper Foil Type
- HVLP (VLP2) ≤2.5 micron Rz JIS, 1 oz and below is standard
- RTF (Reverse Treat Foil)
Copper Weight
- ½, 1 oz (18 and 35 µm) available
- Thinner copper foil available
Standard Material Offering: Prepreg
- Moisture barrier packaging
Glass Fabric Availability
- Low Dk Glass -Asahi Japan, Asahi Tawian, TGI Taiwan
- Square weave glass
- Mechanically spread glass