- Polymer Name:Polyimide (PI)
- Functions:Prepreg
- Reinforcement Material:Glass Fibers
- End Uses:Medical Devices
P25N consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.