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KİSAMİD® 1023

1 of 15 products in this brand
KİSAMİD® 1023 is a formulated polyamine adduct used in SF epoxy systems and can be cured at low temperatures. KISAMID® 1023 can be used in combination with other hardeners in SF coatings, adhesives, mortars, self leveling.

Functions: Curing Agent

Chemical Family: Polyamines

End Uses: Solventless & High Solids Coating

Compatible Polymers & Resins: Epoxies (EP)

Features: Low Temperature-Curing

    Knowde Enhanced TDS

    Identification & Functionality

    Chemical Family
    CASE Ingredients Functions
    Technologies

    Features & Benefits

    CASE Ingredients Features

    Applications & Uses

    Compatible Polymers & Resins

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Amine Value370-390
    Colormax. 10Gardner
    Viscosity at 25°C850-1000mPa.s
    Solid Content100%
    Density at 20°C0.95+0.05g/ml
    Active H Equivalent Weight95
    Flash Point130°C
    Mixing Ratio50
    Gel Time (100ml/23°C)25dk
    Chemical Resistance Acids2
    Chemical Resistance Bases0
    Chemical Resistance Solvents2