- Functions:Curing Agent
- Chemical Family:Polyamines
- End Uses:Solventless & High Solids Coating
- Compatible Polymers & Resins:Epoxies (EP)
- Features:Low Temperature-Curing
KİSAMİD® 1022 is a formulated polyamine adduct mostly used in SF epoxy systems and can be cured at low temperatures. KISAMID® 1022 can be used in combination with other hardeners in SF coatings, adhesives, mortars, self leveling.