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Latiohm™ 66-06 PD03 G/20

1 of 36 products in this brand
Semiconductive/dissipative product based on Polyamide 66 (PA66). Glass fibres.

Polymer Name: Polyamide 66 (PA 66)

Processing Methods: Injection Molding

Fillers Included: Glass Fiber

Technical Data Sheet
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Identification & Functionality

Chemical Family
Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Materials Features

Applications & Uses

Plastics & Elastomers Processing Methods

Properties

Mechanical Properties
ValueUnitsTest Method / Conditions
Stress at break180MPaISO 527
Tensile Modulus12000MPaISO 527
Strain at break2.5%ISO 527
Charpy notched impact strength (+23°)7kJ/m2ISO 179/1eA
Charpy impact strength (+23°)45kJ/m2ISO 179/1eU
Izod Impact notched (1/8 in)60J/mASTM D 256
Physical Properties
ValueUnitsTest Method / Conditions
Molding shrinkage - parallel0.5%ISO 294-4, 2577
Molding shrinkage - normal1.1%ISO 294-4, 2577
Density1340kg/m3ASTM D 792
Thermal Properties
ValueUnitsTest Method / Conditions
Temperature of deflection under load (1.80 Mpa)245°CISO 75-1/-2
Temperature of deflection under load (0.45 Mpa)260°CISO 75-1/-2
Vicat softening temperature255°CISO 306
Electrical Properties
ValueUnitsTest Method / Conditions
Surface Resistivity1.00E+05ohmASTM D 257

Packaging & Availability

Regional Availability
  • Asia Pacific
  • Europe
  • Latin America
  • North America