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Latiohm™ 66-10 H2 CNT G/35

1 of 36 products in this brand
Semiconductive/dissipative product based on Polyamide 66 (PA66). Heat stabilised. Carbon nanotubes. Glass fibres.

Polymer Name: Polyamide 66 (PA 66)

Processing Methods: Injection Molding

Fillers Included: Carbon Nanotube, Glass Fiber

Additives Included: Heat Stabilizer

Technical Data Sheet
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Identification & Functionality

Additives Included
Chemical Family
Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers Processing Methods

Properties

Mechanical Properties
ValueUnitsTest Method / Conditions
Stress at break185MPaISO 527
Tensile Modulus11500MPaISO 527
Strain at break2.5%ISO 527
Charpy notched impact strength (+23°)7kJ/m2ISO 179/1eA
Charpy impact strength (+23°)50kJ/m2ISO 179/1eU
Izod Impact notched (1/8 in)75J/mASTM D 256
Physical Properties
ValueUnitsTest Method / Conditions
Molding shrinkage - parallel0.5%ISO 294-4, 2577
Molding shrinkage - normal1.2%ISO 294-4, 2577
Density1410kg/m3ASTM D 792
Thermal Properties
ValueUnitsTest Method / Conditions
Temperature of deflection under load (1.80 Mpa)250°CISO 75-1/-2
Temperature of deflection under load (0.45 Mpa)260°CISO 75-1/-2
Vicat softening temperature255°CISO 306
Electrical Properties
ValueUnitsTest Method / Conditions
Surface Resistivity3.00E+07ohmASTM D 257
Volume Resistivity200000000.0ohm.mIEC 60093

Packaging & Availability

Regional Availability
  • Asia Pacific
  • Europe
  • Latin America
  • North America