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Leuna-Harze GmbH

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Industrial Additives & Materials

20 Products found on Leuna-Harze GmbH

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Epilox® A 19-00 banner

Epilox® A 19-00

Functions:Binder & Resin
Chemical Family:Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces:Concrete
Features:Low Viscosity

Epilox A 19-00 is a medium viscosity and solventless bisphenol A epoxy resin which may crystallize on storage.

Epilox® A 52-02 banner

Epilox® A 52-02

Chemical Family:Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy, Bisphenol Epoxy Resins
End Uses:Powder Coating, Epoxy Adhesive
Compatible Substrates & Surfaces:Concrete, Metal

Epilox A 52-02 is an unmodified epoxy resin based on bisphenol A and epichlorohydrin.

Epilox® F 16-01 banner

Epilox® F 16-01

Applications:Electronics Adhesives, Appliances & Electronics, Potting Compounds
Product Families:Epoxies, Resins & Binders
Chemical Family:Phenols & Phenolics, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:Epoxy Adhesive

Epilox F 16-01 is a colorless, low-molecular-weight bisphenol F epoxy resin.

Epilox® AF 18-30 banner

Epilox® AF 18-30

Functions:Binder & Resin
Chemical Family:Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
Compatible Substrates & Surfaces:Concrete

Epilox AF 18-30 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.

Epilox® T19-34/700 banner

Epilox® T19-34/700

Chemical Family:Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives

Epilox T 19-34/700 is a modified, low viscosity epoxy resin which is resistant to crystallization. Crosslinking with suitable curing agents is preferably performed at room temperature.

Epilox® A 19-04 banner

Epilox® A 19-04

Applications:Electronics Adhesives, Appliances & Electronics, Potting Compounds
Product Families:Epoxies, Resins & Binders
Chemical Family:Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:Epoxy Adhesive

Epilox A 19-04 is a low molecular weight bisphenol A epoxy resin with medium viscosity.

Epilox® A 18-00 banner

Epilox® A 18-00

Functions:Binder & Resin
Chemical Family:Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces:Concrete
Features:Low Viscosity

Epilox A 18-00 is a low viscosity and solventless bisphenol A epoxy resin which may crystallize on storage.

Epilox® T 19-27 banner

Epilox® T 19-27

Chemical Family:Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
End Uses:Primer, Epoxy Adhesive
Compatible Substrates & Surfaces:Concrete

Epilox T 19-27 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.

Epilox® A 19-02 banner

Epilox® A 19-02

Functions:Binder & Resin
Chemical Family:Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces:Concrete

Epilox A 19-02 is medium viscosity and solventless bisphenol A epoxy resin.

Epilox® T19-32/700 banner

Epilox® T19-32/700

Chemical Family:Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:Primer, Solventless & High Solids Coating, Epoxy Adhesive
Compatible Substrates & Surfaces:Concrete
Features:Low Viscosity

Epilox T 19-32/1000 is a modified, low viscosity epoxy resin with reduced crystallization tendency. Crosslinking with suitable curing agents is preferably performed at room temperature.

Epilox® A 17-01 banner

Epilox® A 17-01

Applications:Electronics Adhesives, Appliances & Electronics, Potting Compounds
Product Families:Epoxies, Resins & Binders
Chemical Family:Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:Epoxy Adhesive

Epilox A 17-01 is a colorless, low-molecular-weight bisphenol A epoxy resin.

Epilox® T19-36/700 banner

Epilox® T19-36/700

Functions:Binder & Resin
Chemical Family:Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces:Concrete

Epilox T 19-36/700 is a modified, low viscosity epoxy resin with reduced crystallization tendency. Crosslinking with suitable curing agents is preferably performed at room temperature