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National Aerospace Supply NA 1150

National Aerospace Supply NA 1150 is used as the release layer in the lay-up of vacuum-bag molds for advanced composites structures. Unmatched tear strength plus non-stick release properties enable NA 11500 film to reduce production rejects as well as set-apart since it yields at least 25 percent more surface area per pound than FEP films.

Compatible Polymers & Resins: Epoxies (EP), Phenolic Resins, Polyesters

Technical Data Sheet

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Identification & Functionality

Features & Benefits

Features
  • Bold and white tinted grades of NA1150 film provide positive visual checks of lay-up coverage and removal after curing.
  • Perforated film grades in various patterns release trapped gasses and excess resin for increased production efficiency.
  • The excellent elongation of NA 1150 film makes it possible to conform closely to complex tool geometry with deep draw capability.
  • Autoclave temperatures up to 375°F are sustained with no appreciable affect on film properties.
  • NA 1150 film is unaffected by and release casily from epoxy, polyester, phenolic and other composite matrix resin systems.

Applications & Uses

Compatible Polymers & Resins

Properties

Physical Form
Physical Properties
ValueUnitsTest Method / Conditions
Melting Point240.0°CASTMD-1505
Tensile Strength (MD)10000.0psiASTM D-88
Elongation200.0%ASTM D-88
Graves Tear450.0gms/milASTM D-100
Elmendorf TearDoes not teargms/milASTM D-192
Dimensional Stability % (100 degrees F - 10 minutes)2.0Oven

Packaging & Availability

Packaging Type
Packaging
Standard roll size plain and perforated, ecear, white or blue 0.001
48"x600
0.002
48"x300
Perforations P1=.045"diameter hole, staggered on 1/4" centers.
P3=.015"diameter hole, staggered on 1/4" centers.