Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Chemical Name
- Base Chemicals Functions
- Industrial Additives Functions
- CAS No.
- 7440-22-4
- EC No.
- 231-131-3
- Technologies
Features & Benefits
- Labeling Claims
- Key Features
- Uniform dispersion for screen/stencil printing or dispensing
- Low sintering temperature (<260oC)
- Excellent sintered properties
- RoHS compliant
Applications & Uses
- Applications
- Applicable Processes
- Base Chemicals End Uses
- Applications
Bonding small to large chips (over 10mm x 10mm) for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, RF power devices.
Properties
- Physical Properties
| Value | Units | Test Method / Conditions | |
| Solid Loading (Before Sintering) | 71 - 91 | % | — |
| Density (Before Sintering) | min. 3.0 | g/cm3 | — |
| Viscosity (Before Sintering) | 150,000 - 600,000 | cps | — |
| Sintering Temperature (Before Sintering) | max. 260 | °C | — |
| Porosity (After Sintering) | max. 30 | % | — |
| Density (After Sintering) | min. 7.9 | g/cm3 | — |
| Coefficient Of Thermal Expansion (After Sintering) | 19.6 x10⁻⁶ | cm.°C | — |
| Melting Temperature (After Sintering) | 961.0 | °C | — |
| Elastic Modulus (After Sintering) | 10 - 30 | GPa | — |
| Electrical Resistivity (After Sintering) | max. 2.6x10⁻⁶ | ohm-cm | — |
| Thermal Conductivity (After Sintering) | min. 2.0 | watt/cm.°C | Electrical Measurement |
| Chip Bonding Strength (After Sintering) | min. 25 | MPa | — |
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Packaging Type
Storage & Handling
- Storage
Shelf Life - approx. 12 months (If Stored In Sealed Containers At Room Temperature, Before Sintering)