Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- CASE Ingredients Functions
- Technologies
- Chemical Structure
Features & Benefits
- CASE Ingredients Features
- Properties
- High cross-linking density with excellent heat
resistance and thermosetting performance. - Minimum UV and lighting absorption provide with superb
visibility. - Disperse fine powder with suspension stability for
reactive latency. - Low chlorine contents, inhibit deterioration and electrolytic
corrosion.
- High cross-linking density with excellent heat
Applications & Uses
- Applications
- Compatible Polymers & Resins
- Compatible Substrates & Surfaces
- Coating Type
- Application
TEPIC consists of triazine nucleus and three glycidyl group. TEPIC triazine nucleus imparts outdoor durability due to low UV absorption.
TEPIC three glycigyl group imparts high heat resistance due to high cross link density. TEPIC has a wide variety of industrial applications such as:- Print circuit board (PCB)
– Top-coated ink
– Solder-resistant ink (PCB solder mask)
– High performance SRI for PC and Cell Phone
– Short circuit prevention: Permanent protective coating of PCB
– Increased heat and solvent resistance– Resolving power up - Transparent encapsulate (LED, CCD)
- Semiconductor encapsulate
- Plastic, rubber, and adhesive additive
- Outdoor polyester powder coating
- Print circuit board (PCB)
Properties
- Appearance
- Granule
- Typical Properties
| Value | Units | Test Method / Conditions | |
| ECH content | max. 100 | ppm | — |
| Epoxy Equivalent Weight | max. 110 | g/equiv. | — |
| Hydrolyzable Chlorine | max. 2.0 | % | — |
| Melting Point | 90 - 125 | °C | — |
| Particle Size (mesh 99%) | 4 - 42 | nm | — |
| Viscosity at 120°C | max. 100 | CPS | — |