Products

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a natural, thermally conductive polycarbonate, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.Applications: Housings for power components. Encapsulation/housings for bobbins, actuators, and coils. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. LED lighting assemblies.

Polycarbonate Alloy - High temperature (HDT), high Impact, with excellent short and long term heat stability.

Glass reinforced (30 %) Polyether Sulfone, excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Nemcon™ E PK DP104 is a carbon fiber-reinforced polyetheretherketone, characterized by very high strength, stiffness, consistent moldability, and exceptional thermal resistance.

Glass reinforced (20 %) Polyether Sulfone. Excellent chemical and electrical resistance, high stiffness, modulus and HDT.

PET - Fiber Grade with ESD Range Conductivity with improved processability.

Polyether Sulfone Resin - Medium Viscosity, un-reinforced standard grade for easy injection molding.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability.Applications: Housings for power components. Encapsulation/housings for bobbins, actuators, and coils. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. LED lighting assemblies.

PC Alloy - ESD Range Electrical Conductivity with High HDT and improved processability.

Glass reinforced (30 %) - High Temperature Polyamide Alloy, excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Glass reinforced (13 %) High Temperature Polyamide - Blow Molding grade with excellent chemical resistance, improved flow and high HDT.