Products

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PO DP117/X2 is a thermally conductive polyetheretherketone, offering excellent chemical resistance, good stiffness and high HDT. It should be used in demanding applications where thermal management must be accomplished in harsh environments.

Polycarbonate Alloy - High temperature (HDT), high Impact, with excellent short and long term heat stability.

Glass reinforced (30 %) Polyether Sulfone, excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Glass reinforced (20 %) Polyether Sulfone. Excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Polyether Sulfone Resin - Medium Viscosity, un-reinforced standard grade for easy injection molding.

Glass reinforced (30 %) - High Temperature Polyamide Alloy, excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Glass reinforced (13 %) High Temperature Polyamide - Blow Molding grade with excellent chemical resistance, improved flow and high HDT.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PA DP117/X3 is a thermally conductive polyetheretherketone, offering excellent chemical resistance, good stiffness and high HDT. It should be used in demanding applications where thermal management must be accomplished in harsh environments.