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Ovation Polymers

14 Products found on Ovation Polymers in Equipment & Parts

Uttap™ ES 10559 banner

Uttap™ ES 10559

Polymer Name:Polycarbonate Alloy (PC Alloy)
Density:1340.0 - 1340.0 kg/m³
Flexural Modulus:1980.0 - 1980.0 MPa

Polycarbonate Alloy - High temperature (HDT), high Impact, with excellent short and long term heat stability.

Uttap™ - SF 50030 GF banner

Uttap™ - SF 50030 GF

Polymer Name:Polyethersulfone (PES)
Fillers Included:Glass Fiber
Flexural Modulus:11300.0 - 11300.0 MPa

Glass reinforced (30 %) Polyether Sulfone, excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Nemcon™ H PC/ABS DP182 banner

Nemcon™ H PC/ABS DP182

Polymer Name:PC/ABS Alloy
Processing Methods:Injection Molding
Density:1690.0 - 1690.0 kg/m³
Flexural Modulus:3690.0 - 3690.0 MPa

Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.

Nemcon™ H PPS DP148 banner

Nemcon™ H PPS DP148

Polymer Name:Polyphenylene Sulfide (PPS)
Processing Methods:Injection Molding
Flexural Modulus:4700.0 - 4700.0 MPa

PPS based, thermally conducting, electrically insulating grade with improved processability.

Nemcon™ H PA66 DP187 banner

Nemcon™ H PA66 DP187

Polymer Name:Polyamide 66 (PA 66)
Processing Methods:Injection Molding
Flexural Modulus:7400.0 - 7400.0 MPa

Thermally conductive Nylon 6,6.

Nemcon™ H PC DP184 banner

Nemcon™ H PC DP184

Polymer Name:Polycarbonate (PC)
Processing Methods:Injection Molding
Flexural Modulus:6750.0 - 6750.0 MPa

Thermally conductive Polycarbonate

Nemcon™ H PPS DP149 banner

Nemcon™ H PPS DP149

Polymer Name:Polyphenylene Sulfide (PPS)
Processing Methods:Injection Molding
Flexural Modulus:6150.0 - 6150.0 MPa

PPS based, thermally conducting, electrically insulating grade with improved processability.

Uttap™ - SF 50020 GF banner

Uttap™ - SF 50020 GF

Polymer Name:Polyethersulfone (PES)
Fillers Included:Glass Fiber
Flexural Modulus:8200.0 - 8200.0 MPa

Glass reinforced (20 %) Polyether Sulfone. Excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Uttap™ - SF 600 banner

Uttap™ - SF 600

Polymer Name:Polyethersulfone (PES)
Processing Methods:Injection Molding
Flexural Modulus:2800.0 - 2800.0 MPa

Polyether Sulfone Resin - Medium Viscosity, un-reinforced standard grade for easy injection molding.

Nemcon™ H PC/ABS DP188 banner

Nemcon™ H PC/ABS DP188

Polymer Name:PC/ABS Alloy
Processing Methods:Injection Molding
Density:1700.0 - 1700.0 kg/m³
Flexural Modulus:3500.0 - 3500.0 MPa

Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.

Uttap™ - QU HT530 GF banner

Uttap™ - QU HT530 GF

Polymer Name:Polyamide (unspecified)
Fillers Included:Glass Fiber
Flexural Modulus:10500.0 - 10500.0 MPa

Glass reinforced (30 %) - High Temperature Polyamide Alloy, excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Uttap™ - QU BM513 GF banner

Uttap™ - QU BM513 GF

Polymer Name:Polyamide (unspecified)
Processing Methods:Blow Molding
Fillers Included:Glass Fiber
Flexural Modulus:4300.0 - 4300.0 MPa

Glass reinforced (13 %) High Temperature Polyamide - Blow Molding grade with excellent chemical resistance, improved flow and high HDT.

Nemcon™ H PC DP164 banner

Nemcon™ H PC DP164

Polymer Name:Polycarbonate (PC)
Processing Methods:Injection Molding

PC based, thermally conducting, electrically insulating grade with improved processability.

Nemcon™ H PPS DP183 banner

Nemcon™ H PPS DP183

Polymer Name:Polyphenylene Sulfide (PPS)
Processing Methods:Injection Molding
Flexural Modulus:9915.0 - 9915.0 MPa

Thermally conductive Polyphenylene Sulfide