Perlast® G75H incorporates a novel reinforcement system which produces a synthetically clean compound formulated for minimum particle generation combined with excellent resistance to aggressive oxygen and fluorine based plasmas.Specially developed for Plasma and Gas Deposition applications including ashing, etching, HDPCVD, PECVD, SACVD.Particularly suited for use in applications which require exposure to temperatures of up to 320°C (608°F) combined with excellent mechanical properties.Key Attributes Excellent plasma resistance High temperature stability Wide chemical resistance Low out-gassing properties making it ideal for vacuum applications Ultra low metal ion content Low coefficient of thermal expansion Outstanding physical properties make G75H ideal for dynamic applications. Typical Applications Dynamic seals Static seals Other components
Polymer Name: Perfluoroelastomer (FFKM)
Features: Chemical Resistant, Good Thermal Stability, Heat Resistance, Low CLTE, Low Outgassing
