- Applications:Mining, Consumer Electronics, Adhesives & Sealants
- Product Families:Encapsulants, Contact Adhesives, Structural Adhesives
- Chemical Family:Epoxy & Epoxy Derivatives
BONDiT™ B-482 is a two-part, state-of-the-art 100% solids, room-temperature curing flexible epoxy resin system. Especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, hard coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.