Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Info
B-52 handles harsh environments easily and is particularly effective against moisture, salt water, acids, alkalies, oils, and detergents. B-52 offers good
corrosion resistance. B-52 has good thermal stability—at elevated temperatures of 200°F the B-52 becomes rubbery and provides supperior accomodation of
wide thermal expansion excursions characteristic of dissimilar material bonding.
The flexible properties of B-52 permit assembly of materials with dissimilar thermal expansion and survive thermal cycling. Likewise mechanical vibration, shock and impact are easily absorbed by B-52 and it protects surfaces, bonded assemblies and encapsulated sensitive electronics.
B-52 is also available in Thixotropic format, called B-521 which is a unique epoxy system having a dual glass transition temperature: at higher temperatures of 200°F the system cures in seconds to a rubbery state—a flexible solid. On cooling it transitions into a semi-rigid state, providing high strength with a good balance of impact and shock resistance and enough flexibility to handle thermalcycle.
Hence, both B-52 and B-521 offer rapid cures between glass and plastic, and on cool down joint stresses are released to produce a structural stress free bond between dissimilar materials in minutes. Stress free potting for electronics fast cure is obtained at low temperatures suitable for electronics. Eliminates warping and fractures in assemblies. Excellent for autoclave applications of composite laminates with long pot life for assembly and cure in seconds with a flexible bond line.Eamples of applications are assembly of glass to acrylic and polycarbonate lighting fixtures, consumer electronics potting, and military componentsexposed to harsh environments.
Applications & Uses
- Markets
- Applications
- Application Area
- Compatible Substrates & Surfaces
- Cure Method
- Curing Guide
B-521 is off-white in color, silicate filled and thixotropic, meaning a thick coating on vertical surfaces will not sag, but is easily poured from a can. Apply B-52 and B-521 by roller or brush. B-52 and B-521 are very easy to use with low HAZMAT impact as a 100% solids epoxy system no plasticizers that bloom to the surface and no solvents causing VOC problems.
- Applications Notes
Mix part A with part B, 10:1 ratio by volume or weight. Pot life is typically 30 - 40 minutes, at ambient temperature. Preferred surface prep for some substrates is by
abrading or grit blasting substrates with #100 AlOx followed by degrease and/or alcohol wipe. Substrates such as acrylic, polycarbonate and glass require no abrasion.
The usable shelf life of unopened containers of BONDiTTM B-52 and B-521resin is one year, and it should be stored in cool, dry place. When not in use, containers should be kept tightly closed.
BONDiTTM B-52 and B-521 are available in side-by-side handheld and pneumatic actuated gun cartridges, quarts, gallons, pails and drums. Custom packaging, such as premixed and degassed frozen cartriges, is also available.- High Performance
Superior chemical resistance for moisture and oil, acids and bases in continuous full submersion. High tensile and shear in a rugged flexible system.
- Easy Use
Two part, primerless, flexible epoxy, ambient and thermal cure. Low HAZMAT impact. Available in handheld and pneumatic gun actuated cartridges, quarts, gallons and drums
- Harsh Environments
- "
Marine,Civil Engineering, Industrial, Downhole oil, Underwater, Mining, Industrial,, Automotive.
"
Technical Details & Test Data
- Bonds Dissimilar Materials
A fast cure semi-rigid adhesive for bonding dissimilar materials such as plastics to glass and metals, including acrylic and polycarbonate.
- Test Data
Lapshear test: ASTM D3163; all values mean; all failures adhesive/cohesive at plastic-adhesive interface.
Adhesive
Substrate
#1/#2
Failure
Mode
Dure
Temp
°F
Peak
Stress
PSI
Sample
Range Hi/Lo
Peak Stress
PSI
Strain
Peak
Load
%
Energy
Peak
Load
In-Lb
Break
Stress
PSI
Elongation
at Break
%
Yield
Stress
PSI
Elongation
at Yield
%
Tangent
Modulus
PSI
B-52
SS/SS*
Bulk
Adhesive
Failure
150
1803
1963/1646
2.18
25.64
1789
2.2
1783
2.1
116527
B-52
PC*/SS
Failure at
SS Interface
150
710
779/657
1.95
8.48
723
2
636
1.8
41970
B-52
PC/PC
PC
Fractured
150
1084
1267/905
4.24
26.39
1129
4.5
999
3.9
27111
B-52
PC/Glass/PC
Glass
Failure
150
647
681/578
2.3
8.64
647
2.3
629
2.2
31471
B-52
SS/Glass/SS
Glass
Failure
150
1502
1736/1251
1.5
12.08
1453
1.7
1511
1.7
116920
Tehsile Test: ASTM D638; all values mean
Adhesive
Substrate
#1/#2
Dure
Temp
°F
Peak
Stress
PSI
Sample
Range Hi/Lo
Peak Stress
PSI
Strain
Peak
Load
%
Energy
Peak
Load
In-Lb
Break
Stress
PSI
Elongation
at Break
%
Yield
Stress
PSI
Elongation
at Yield
%
Tangent
Modulus
PSI
B-52
Tensile
150
1902
2190/1496
8.15
14.46
1893
8.2
1902
8.2
134447
B-52
Tensile
150
2533
2785/2305
1.03
131.82
2490
51,6
2478
44.9
40279
Packaging & Availability
- Packaging Type
Storage & Handling
- Storage
A wide range of curing regimes may be employed: ambient set in 4 hours, tack free in 12 hours, and 95% cure in 24 hours. Post curing at 150°F, after 2 hours at ambient to allow bubble escape, will cure 98% in 4 hours, or 2 hours at 200°F.