- Applications:Adhesives & Sealants, Mining, Consumer Electronics
- Product Families:Structural Adhesives, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
BONDiT™ B-521 is a two-part, state-of-the-art 100% solids, elevated-temperature, fast curing, semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding engineering plastics and elastomers to various substrates–particularly rigid substrates such as glass, metals and ceramic, without stress build up and joint or substrate fracture.