Product

BONDiT™ B-4682 is a two-part, state-of-the-art 100% solids, room-temperature curing, very flexible epoxy resin system. Especially designed for adhesive and potting applications in bonding to unprepped engineering plastics and elastomers to various substrates. Bondable plastics include --UHMW, HDPE, PP, PET (Ertalite & Mylar), PEEK, PPS, PBT (Valox) Acetal (Delrin), PTFE (Teflon), ETFE (Tefzel), PVC, PVCF, PVDF (Kynar), ABS, ECTFE (Halar), polyamide and polyimide (Ultem & Torlon), fiberglass and composites. Elastomers include EPDM, butyl, neoprene, urethanes, and some thermoplastic elastomers (Hytrel). The B-4682 will bond these materials to metals, glass, ceramic, cement, wood and cellulose substrates, as well as to each other.