Products

BONDiT™ A-3 is a high performance, high temperature moisture resistant, primer, adhesive, adhesion promoter and additive used with metals, glass & ceramics, elastomers and polymers. BONDiT™ A-3 offers a wide range of capabilities for moisture resistance chemical bonding betweenminerals and polymers, as well as dissimilar polymers. it is used as a primer coat and additive for other BONDiT™ coatings and encapsulants. BONDiT™ A-3 may be used as an additive to other coatings, fiber fills, and adhesives to promote superior improvement in performance in harshenvironments.

BONDiT™ C-6 is an all-around general purpose, one-part primer, adhesion promoter and adhesive with moderate chemical resistance for metals, glass & ceramics, thermoplastics and thermoset polymers. BONDiT™ C-6 offers a wide range of capabilities for promoting single coat chemical bonding between coatings, sealants and adhesives of very diverse properties to mineral and polymer substrates. It is used as a primer coat for other BONDiT™ coatings and encapsulants.

BONDiT™ A-43 is a high performance, high and low temperature one-part primer, adhesive, adhesion promoter for metals, glass & ceramics, elastomers and polymers. BONDiT™ A-43 offers a wide range of capabilities for promoting single coat chemical bonding between minerals and polymers, as well as dissimilar polymers. it is used as a primer coat for other BONDiT™ coatings and encapsulants.

BONDiT™ C-52 is an all-around general purpose, one-part primer, adhesion promoter and adhesive with moderate chemical resistance for metals, glass & ceramics, thermoplastics and thermoset polymers. BONDiT™ C-52 offers a wide range of capabilities for promoting single coat chemical bonding between coatings, sealants and adhesives of very diverse properties to mineral and polymer substrates. It is especially useful as a primer and adhesion promoter for injection molding to metal and glass with polyethylene, polypropylene and polyolefins in general, PPS, PVC, PBT, ABS, polysulfone, polystyrene, polyamide (nylon 6 and 66), polyamide-imide, polyimide, polyvinylbutyral, melamine, polycarbonate, polyester, polyether, phenolic, and epoxy, with molding temperatures up to 328°C/622°F.

BONDiT™ B-4682 is a two-part, state-of-the-art 100% solids, room-temperature curing, very flexible epoxy resin system. Especially designed for adhesive and potting applications in bonding to unprepped engineering plastics and elastomers to various substrates. Bondable plastics include --UHMW, HDPE, PP, PET (Ertalite & Mylar), PEEK, PPS, PBT (Valox) Acetal (Delrin), PTFE (Teflon), ETFE (Tefzel), PVC, PVCF, PVDF (Kynar), ABS, ECTFE (Halar), polyamide and polyimide (Ultem & Torlon), fiberglass and composites. Elastomers include EPDM, butyl, neoprene, urethanes, and some thermoplastic elastomers (Hytrel). The B-4682 will bond these materials to metals, glass, ceramic, cement, wood and cellulose substrates, as well as to each other.

BONDiT™ B-46 is a two-part, state-of-the-art 100% solids, room-temperature curing, very flexible epoxy resin system. Especially designed for adhesive and potting applications in bonding to unprepped engineering plastics and elastomers to various substrates. Bondable plastics include --UHMW, HDPE, PP, PET (Ertalite & Mylar), PEEK,PPS, PBT (Valox) Acetal (Delrin), PTFE (Teflon), ETFE (Tefzel), PVC, PVCF, PVDF (Kynar), ABS, ECTFE (Halar), polyamide and polyimide (Ultem & Torlon), fiberglass and composites. Elastomers include EPDM, butyl, neoprene, urethanes, and some thermoplastic elastomers (Hytrel). The B-46 will bond these materials to metals, glass, ceramic, cement, wood and cellulose substrates, as well as to each other.