Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Keynotes
- Rosin-based low-activity ROL0 (No-clean)
- Semiconductors, extended 350°C high- temperature reflow profiles, multi-step assemblies.
- 350°C-450°C Hot Air Rework flux with high-solids content fine-tuned for clarity & minimum top-ups.
- Top-class longevity and activity for leaded or lead-free alloys with wide application range.
- Low voiding. Long stencil life & process window.
- Exceptional printing edge definition.
- Excellent wetting on most PCB finishes.
- Compatible with enclosed printing heads.
Applications & Uses
- Markets
- Application Area
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Stencil Life (at 30 - 70% R/H & 20 - 25°C) | max. 12 | hours | - |
Technical Details & Test Data
- Viscosity
Print jar/cartridge Dispense syringe Tacky flux Tack force (g/cm) 200-285 90-160 43-71 44-48 * Malcom @ 10 RPM @ 25°C x103 g/cm/s
- Printer Operations
Stencil printer does not require any specific optimization, should be fully adjustable based on standard in-house process requirements, including high-speed printers
Print Speed: 20-200 mm/sec (add pressure for speed)
Squeegee Pressure: 70-540 g/cm of blade (add for speed)
Stencil Vac/Wipe: Every 10-25 prints or as necessaryAutomated and vacuum cleaning systems for both stencil and misprinted boards. Manual cleaning using Isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.
- Test Results
IPC-TM-650 Test Value Result Corrosion 2.6.15 L: No corrosion PASS Copper Mirror 2.3.32 L: No breakthrough PASS ECM (No-clean) 2.6.14.1 <1 decade drop PASS Quantitive Halides 2.3.28.1 L: <0.05% PASS SIR Test (No-clean) 2.6.3.7 ≥100 MΩ PASS - Printing
Optimal print definition for fine pitch applications. Long stencil life of this product virtually eliminates waste of solder paste. For mesh/size determination refer to the Pitch Requirements chart below:
Size (micron) Type Value 75 - 45 μm T2 24 mil + 45 - 25 μm T3 16 - 24 mil 38 - 20 μm T4 12 - 16 mil 25 - 15 μm T5 < 12 mil 20 - 5 μm T6 < 8 mil - Sample Reflow Profile
Sample Reflow Profile for circuit board assembly applications using Sn10Pb88Ag2 alloy, either a straight ramp-spike or ramp-soak-spike profile can be used as shown below. Both profiles would have a similar peak temperature and time above liquidus (TAL). The shaded area defines the process window.
Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal-couples attached is recommended to optimize the process.
For other assemblies requiring this high melting point alloy, best results are achieved using a linear ramp rate profile that reaches a peak temperature of 325°C ± 5°C as fast as possible. Some of the alloys the HT chemistry will have successful applications are Sn10Pb88Ag2.
Packaging & Availability
- Packaging Type
- Availability
STIRRI-HT™ - available in the following alloys of a low-oxide, spherical and uniformly sized powder: Sn10Pb88Ag2, Sn95Ag5, Sn95Sb5 & Sn5Pb93.5Ag1.5
- Packaging Information
Options with various viscosity and metal load for stencil printing and dispensing applications:
- Printing: Jars, 1/4 NPT nozzle cartridges
- Dispensing: Syringes, ProFlow cassettes
Storage & Handling
- Shelf Life, Storage, and Handling
Refrigerated storage at 5-7°C will prolong the solder paste shelf life to no less than 6 months. Solder Paste should be allowed to reach ambient temperature, normalize for about 6-8 hours before use. Tacky flux has 24 months shelf life stored in room temperature. Refrigeration won't extend shelf life. Normalize for 4-6 hours if stored refrigerated. Paste/flux in syringes and cartridges should be kept vertically, dispensing tip pointing down.
Note :Never freeze solder paste / flux!