Red Ice

Red Ice 615 is specifically designed to eliminate compound “dry-out” problems due to the continuous exposure temperatures exceeding 200C (392F). This non-silicone thermal compound specially formulated for applications with continuous temperatures exceeding 200 degree celcius and intermittent temperatures up to 250 degree celcius. It shown outstanding stability and efficient heat transfer for the full operational life of your hardware. Red Ice 615 is a low cost solution for high temperature heat transfer applications. Offer high temperature stability up to 250 degree celcius. This thixotropic compound provides high di-electric property, excellent wetting, dispensability and long term stability.

Red Ice 613 is specifically designed to eliminate compound “dry-out” problems due to the continuous exposure temperatures exceeding 200 degree celcius. This silicone thermal compound specially formulated for applications with continuous temperatures exceeding 200 degree celcius and intermittent temperatures up to 250 degree celcius. It shown outstanding stability and efficient heat transfer for the full operational life of your hardware. Red Ice 613 offers high thermal conductivity and high temperature stability up to 250 degree celcius. This thixotropic compound provides high di-electric property, excellent wetting, dispensability and long term stability.

Red Ice 614 is specifically designed to eliminate compound “dry-out” problems due to the continuous exposure temperatures exceeding 200 degree celcius. This non-silicone thermal compound specially formulated for applications with continuous temperatures exceeding 200 degree celcius and intermittent temperatures up to 250 degree celcius. It shown outstanding stability and efficient heat transfer for the full operational life of your hardware. Red Ice 613 offers high thermal conductivity and high temperature stability up to 250 degree celcius. This thixotropic compound provides excellent wetting, dispensability and long term stability.

Red Ice 610 is specifically designed to eliminate compound “dry-out” problems due to the continuous exposure temperatures exceeding 200 degree celcius. This non-silicone thermal compound specially formulated for applications with continuous temperatures exceeding 200 degree celcius and intermittent temperatures up to 300 degree celcius. It shown outstanding stability and efficient heat transfer for the full operational life of your hardware. Red Ice 610 This product is formulated with FDA (Food & Drug Administration) approved ingredients in compliance with CFR, Title 21 paragraph 178.3570 of the FDA guidelines. This product is acceptable as incidental food contact for use in and around food processing areas.

Red Ice 611 is specifically designed to eliminate compound “dry-out” problems due to the continuous exposure temperatures exceeding 200 degree celcius. This non-silicone thermal compound specially formulated for applications with continuous temperatures exceeding 200 degree celcius and intermittent temperatures up to 360 degree celcius. It shown outstanding stability and efficient heat transfer for the full operational life of your hardware. Red Ice 611 is low viscosity high temperature stable thermal grease. It is formulated with high temperature stable non-silicone fluids and unique fillers. This compound provides minimal out gassing (Meets NASA outgassing requirements), high thermal conductivity, low bleed and high temperature stability.

Red Ice 611LV is specifically designed to eliminate compound “dry-out” problems due to the continuous exposure temperatures exceeding 200 degree celcius. This non-silicone thermal compound specially formulated for applications with continuous temperatures exceeding 200 degree celcius and intermittent temperatures up to 360 degree celcius. It shown outstanding stability and efficient heat transfer for the full operational life of your hardware. Red Ice 611LV is low viscosity, screen printable, high temperature stable thermal grease. It is formulated with high temperature stable non-silicone fluids and unique fillers. This compound provides minimal out gassing, high thermal conductivity, low bleed and high temperature stability.

Red Ice 611HTC is specifically designed to eliminate compound “dry-out” problems due to the continuous exposure temperatures exceeding 200 degree celcius. This non-silicone thermal compound specially formulated for applications with continuous temperatures exceeding 200 degree celcius and intermittent temperatures up to 360 degree celcius. It shown outstanding stability and efficient heat transfer for the full operational life of your hardware. Red Ice 611HTC offers high thermal conductivity and high temperature stability up to 360 degree celcius. This thixotropic compound provides minimal out gassing, low bleed and evaporation.