Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Type
- Silicone Free
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Key Features & Benefits
- Low Viscosity, Screen Printable
- Cost-Effective Thermal Solution
- Non-Silicone Advantages, No creep or contamination
- Thin Bond line Thickness <25 micron
Applications & Uses
- Applications
- Applications
- Interface for semiconductors requiring low pressure or spring clamp mounting
- Thermal sensors, TEC modules, Thermal Wells
- IGBT’s, LED
- Power Transistors, Diodes, Power Resistors
Properties
- Color
- Typical Properties
- Thermal Properties
- Typical Electrical Properties
| Value | Units | Test Method / Conditions | |
| Viscosity (5 rpm, 25°C) | 90.0 | PaS | Helipath |
| Specific Gravity | 2.4 | — | ASTM D792 |
| Operating Temperature Range | -55 to 200 | °C | — |
| Value | Units | Test Method / Conditions | |
| Thermal Conductivity | 0.8 | W/m-K | ASTM D5470 |
| Thermal Resistance | 0.03 | °C-in²/W | ASTM D5470 |
| Value | Units | Test Method / Conditions | |
| Breakdown Voltage | 12.4 | KV/mm | ASTM D149 |
| Dissipation Factor | 0.0021 | 1KHz | ASTM D150 |
| Volume Resistivity | 10¹⁴ | Ohm-cm | ASTM D257 |
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Packaging Type
- Availability
- Syringes (3cc, 10cc, 30cc). Jars (8 oz & 1 Kg). Cartridges (6 oz. Semco & 300cc).
- 1 gallon & 5 gallon pail.
Storage & Handling
- Shelf Life
- 5 years at 25°C