Products

Toray Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties. 177°C (350°F) Cure, Low Dielectric Epoxy Syntactic Film.

Toray Nomex® Honeycomb Core—Aerospace Grade is manufactured from Nomex® paper sheets and is coated and bonded together with a phenolic resin. Designed to offer users and designers high strength-to-weight properties at relatively low cost, Nomex® honeycomb is particularly suitable as a core material for production of sandwich structures requiring significant FST performance and using high performance fiber reinforced composites as the facing material.

Toray Nomex® Honeycomb Core—Commercial Grade is manufactured from Nomex® paper sheets and is coated and bonded together with a phenolic resin. Designed to offer industrial users and designers high strength-to-weight properties at relatively low cost, Nomex® honeycomb is particularly suitable as a core material for production of nonmetallic sandwich structures using high performance fiber reinforced composites as the facing material.

Toray Toray MicroPly™ ES72A-2 is a 125°C (257°F) curing low-density, expanding, unsupported, epoxy syntactic core. ES72A-2 offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin-walled composite sandwich structures. ES72A-2 can be easily contoured and shaped. Toray MicroPly™ ES72A-2 expands using a closed cell process ensuring complete homogeneous cell structure, the density/strength may be altered simply by changing cure pressure or limiting the volume available for expansion, the material is capable of expanding up to 650%. Toray MicroPly™ ES72A-2, formerly Amspand, is available in a variety of thicknesses down to 1 mm, and is supplied in sheets (625 mm x 400 mm).

Toray Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with the high temperature Toray TC420 and Toray EX-1505 prepreg resin systems. 177°C (350°F) Cure, Cyanate Ester Core Splice Adhesive.

Toray Toray MicroPly™ TCF4035 is a syntactic film compatible with 121°C (250°F) epoxy prepregs. It features a 30-day out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot). It features a higher service temperature than Toray TCF4025. Syntactic Epoxy Film.

Toray Toray MicroPly™ EX-1541 cyanate ester syntactic foam is extremely unique in the industry due to its coupling of extremely low density and good structural properties. If packed well, the material does not require pressing during cure to achieve its mechanical properties and is easily machined to shape if required. Toray MicroPly™ EX-1541 is simply packed or injected into tooling cavities and can also be extruded with the proper tooling. Toray MicroPly™ EX 1541’s inherently low dielectric/low loss performance makes it ideal for radomes, antennas, and radar transparent structures, while its cyanate ester backbone chemistry assures low moisture absorption and low outgassing. These latter two features coupled with Toray MicroPly™ EX-1541’s low isotropic CTE make it ideal for spacecraft and other dimensionally stable structures and tooling. Toray MicroPly™ EX-1541 can be accurately machined and hand-finished. Sanding and fairing is easily performed on cured Toray MicroPly™ EX-1541 and is similar to working with balsa wood. Variants from 176–384 kg/m³ (11–24 lb/ft³) (pcf) are available.

Toray Toray MicroPly™ SC72A is a 120°C (248°F) curing low-density unsupported epoxy syntactic core. Toray MicroPly™ SC72A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin-walled composite sandwich structures. Considerable cost reductions can be realized when SC72A replaces prepreg as the core material, and where sandwich cores below 3 mm are difficult to achieve in honeycomb core, Toray MicroPly™ is a superior alternative. Toray MicroPly™ SC72A is available in a variety of thicknesses down to 1 mm and is easily contoured and shaped. SC72A is supplied on a roll (15 m x 400 mm) or in sheets (625 mm x 400 mm). Toray MicroPly™ SC72A is compatible for co-cure with Toray E720 and E722 mid temperature curing prepregs.

Aluminum Flex-Core® honeycomb utilizes either 5052 or 5056 alloy foil material and is available in two cell sizes. FlexCore® has unique cell configurations that significantly reduce anticlastic behavior and permit small radii of curvature without deformation of the cell walls or loss of mechanical properties. Aluminum Flex-Core® has been developed to allow the designer and fabricator freedom in the utilization of honeycomb for components requiring simple and compound curvatures. Highly contoured sandwich panels such as leading edges and flaps, nacelles, fairings, doors, and access covers, and other parabolic, spherical, and cylindrical shapes are prime Flex-Core® candidates. Duplicate die model and control tooling for aerospace use are also examples of Flex-Core® Applicationss. As with standard aluminum honeycomb, Flex-Core® provides controlled crush characteristics without rebound and thus curved energy absorption units become feasible and economical.

Toray Advanced Composites’ aluminum commercial (AAC) grade honeycomb core is manufactured from corrosionresistant 3003 alloy foil. Designed to offer industrial users and designers high strength-to-weight properties at relatively low cost, aluminum honeycomb is particularly suitable as a shear carrying core in adhesively bonded sandwich panel assemblies.

Toray Toray MicroPly™ SC8020A is a low-density unsupported epoxy syntactic core. The material has been developed to offer a long out life and flexible cure schedules at 70°C to 130°C (158°F–266°F). Toray MicroPly™ SC8020A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin walled composite sandwich structures. Considerable cost reductions can be realized when SC8020A replaces prepreg as the core material, and where sandwich cores below 3 mm are difficult to achieve in honeycomb core, Toray MicroPly™ is a superior alternative. Toray MicroPly™ SC8020A is available in a variety of thicknesses down to 1 mm, is easily contoured and shaped. SC8020A is supplied on a roll (15 m x 400 mm) or in sheets (625 mm x 400 mm). Toray MicroPly™ SC8020A is compatible for co-cure with Toray’s E720, E722, and 8020 prepregs.

Toray’s aluminum aerospace (AAA) grade honeycomb core is available in corrosion-resistant 5052 and 5056 alloys. Designed predominately for use in sandwich structures to produce highly engineered structural components. In particular, the material offers the designer high strength-to-weight properties at relatively low cost, aluminum honeycomb is particularly suitable as a shear carrying core in adhesively bonded sandwich panel assemblies.

Toray Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its combination of low density and good structural properties. The material does not require pressure during cure to achieve its mechanical properties, and can be machined to shape if required. Toray MicroPly™ TCF4001 can be packed into tooling cavities. 177°C (350°F) Cure, Cyanate Ester Syntactic Foam.