Products

Toray Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties. 177°C (350°F) Cure, Low Dielectric Epoxy Syntactic Film.

Toray Toray MicroPly™ ES72A-2 is a 125°C (257°F) curing low-density, expanding, unsupported, epoxy syntactic core. ES72A-2 offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin-walled composite sandwich structures. ES72A-2 can be easily contoured and shaped. Toray MicroPly™ ES72A-2 expands using a closed cell process ensuring complete homogeneous cell structure, the density/strength may be altered simply by changing cure pressure or limiting the volume available for expansion, the material is capable of expanding up to 650%. Toray MicroPly™ ES72A-2, formerly Amspand, is available in a variety of thicknesses down to 1 mm, and is supplied in sheets (625 mm x 400 mm).

Toray Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with the high temperature Toray TC420 and Toray EX-1505 prepreg resin systems. 177°C (350°F) Cure, Cyanate Ester Core Splice Adhesive.

Toray Toray MicroPly™ TCF4035 is a syntactic film compatible with 121°C (250°F) epoxy prepregs. It features a 30-day out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot). It features a higher service temperature than Toray TCF4025. Syntactic Epoxy Film.

Toray Toray MicroPly™ SC72A is a 120°C (248°F) curing low-density unsupported epoxy syntactic core. Toray MicroPly™ SC72A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin-walled composite sandwich structures. Considerable cost reductions can be realized when SC72A replaces prepreg as the core material, and where sandwich cores below 3 mm are difficult to achieve in honeycomb core, Toray MicroPly™ is a superior alternative. Toray MicroPly™ SC72A is available in a variety of thicknesses down to 1 mm and is easily contoured and shaped. SC72A is supplied on a roll (15 m x 400 mm) or in sheets (625 mm x 400 mm). Toray MicroPly™ SC72A is compatible for co-cure with Toray E720 and E722 mid temperature curing prepregs.

Toray Toray MicroPly™ SC8020A is a low-density unsupported epoxy syntactic core. The material has been developed to offer a long out life and flexible cure schedules at 70°C to 130°C (158°F–266°F). Toray MicroPly™ SC8020A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin walled composite sandwich structures. Considerable cost reductions can be realized when SC8020A replaces prepreg as the core material, and where sandwich cores below 3 mm are difficult to achieve in honeycomb core, Toray MicroPly™ is a superior alternative. Toray MicroPly™ SC8020A is available in a variety of thicknesses down to 1 mm, is easily contoured and shaped. SC8020A is supplied on a roll (15 m x 400 mm) or in sheets (625 mm x 400 mm). Toray MicroPly™ SC8020A is compatible for co-cure with Toray’s E720, E722, and 8020 prepregs.

Toray Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its combination of low density and good structural properties. The material does not require pressure during cure to achieve its mechanical properties, and can be machined to shape if required. Toray MicroPly™ TCF4001 can be packed into tooling cavities. 177°C (350°F) Cure, Cyanate Ester Syntactic Foam.