Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Characteristics
SE 1262 is a soft and flexible epoxy adhesive for under-filling or encapsulating electronic devices and components such as BGA, chip-on-board, bare die, CSP etc. It is a two-part, capillary flow formulation that cures at elevated temperature to form “rubber-like” soft epoxy that provides protection of electronics with significantly reduced thermal stress. SE 1262 is dispensable. For better flow, it is recommended to pre-warm the applied spot to ~ 105°C.
- Special Features & Benefits
- Softness and flexibility for stress free
- Fast flow and capillary flow
- Bonding to various substrates
- Low bleeding, low volatile
Applications & Uses
- Applications
- Application Area
- Cure Method
- Typical Applications
- Under-filling BGA, Bare die, flip-chip, CSP
- Encapsulate parts, cavities
- Bonding of die to LTCC, Al, Cu
- Attach PCBs, base plates, components
- Seal lids, covers, housings, connectors
- Vibration dampening
- Thermal stress coupling
- Aerospace & Automotive electronics
- Semiconductor & Telecommunications
SE 1262 has a shelf life of at least 12 months when stored at ambient condition (< 25°C) in the originally sealed containers.
- Processing Instruction
- Only components A and B with the same lot number may be processed together! For potting applications, it is recommended to warm the part A to ~60°C, then mix with part B. Any possible air bubbles in mixing or potting process can be removed by vacuum.
- We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.
Properties
- Color
- Typical Properties
- Typical Cured Properties
| Value | Units | Test Method / Conditions | |
| Density | 1.1 | Gram /cc | ASTM D792 |
| Mixing Ratio | 1:1 | In wt. or vol. | - |
| Viscosity (25°C) | 1200.0 | cps | ASTM D2196 |
| Value | Units | Test Method / Conditions | |
| Adhesion (Al/Ai Lap Shear) | min. 200 | Psi | ASTM D1002 |
| Coefficient Of Thermal Expansion | 140.0 | ppm/°C | IPC-TM-650 |
| Cure Time (125°C) | 45.0 | minute | Durometer |
| Cure Time (150°C) | 30.0 | minute | Durometer |
| Dielectric Constant (100 Hz) | 4.0 | - | ASTM D150 |
| Dielectric Strength | min. 400 | Volt/mil AC | ASTM D149 |
| Elongation | 80.0 | % | ASTM D638 |
| Hardness | 32.0 | Shore A | ASTM D2240 |
| Pot/Work Life (After Mixed Up, 25°C) | 12.0 | hour | Viscosity double |
| Temperature Usage | -80 to 160 | °C | TGA |
| Tensile Strength | 2.8 | Mpa | ASTM D638 |
| Volume Resistivity (24°C) | min. 10E+13 | Ohm-cm | ASTM D257 |
Safety & Health
- Safety
General hygiene regulations should be observed.
Storage & Handling
- Storage
SE 1262 has a shelf life of at least 12 months when stored in the originally sealed containers. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.