company tower banner
VSI PARYLENE Company Logo

Parylene Dimer Type N

1 of 3 products in this brand
Parylene Type N Dimer is the solid, granular starting material used to produce parylene conformal coating films.

Chemical Family: Dimers

End Uses: Conformal Coating

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Chemical Family
CASE Ingredients Functions
Technologies
Structure

Parylene Dimer Type N - Structure

Features & Benefits

Labeling Claims

Applications & Uses

Coating Type
Uses

Parylene N is the best choice for:

  • Dry lubricity.
  • High frequency/RF applications because of its low dissipation factor at high frequencies.
  • Applications that require a higher penetration factor.

Properties

Flame Rating
Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Coefficient of Friction (static and dynamic)0.25
% Elongation to Break20 - 250%
Young’s Modulus2.4GPa
Tensile Strength48.3MPa
Yield Strength42.1MPa
Elongation to Break20 - 250%
Elongation at Yield2.5%
Density1.11g/cm³
HardnessR85Rockwell
HardnessR85Rockwell
Coefficient of Friction (Static)0.25
Coefficient of Friction (Dynamic)0.25
Typical Properties
ValueUnitsTest Method / Conditions
Gas Permeability (Oxygen at 25°C)3cc*mm/m²*day*atm
Penetration Power40 X
USP Class VI PolymerYes
Gas Permeability (Nitrogen at 25°C)3cc*mm/m²*day*atm
Gas Permeability (Carbon Dioxide at 25°C)84.3cc*mm/m²*day*atm
Gas Permeability (Hydrogen at 25°C)212.6cc*mm/m²*day*atm
Thermal Properties
ValueUnitsTest Method / Conditions
Short Term Service Temperature (in oxygen environments)95°C
Continuous Service Temperature (in oxygen environments)60°C
Short Term Service Temperature (in inert environments)265°C
Continuous Service Temperature (in inert environments)220°C
Linear Coefficient of Thermal Expansion (at 25° C)69ppm/°C
Thermal Conductivity (at 25° C)0.126W/m*K
Specific Heat0.2cal/g*°C
Melting Point420.0°C
Melting Point420°C
Short-term Service Temperature (Oxygen Environment)95.0°C
Short-term Service Temperature (Inert Environment)265.0°C
Continuous Service Temperature (Oxygen Environment)60.0°C
Continuous Service Temperature (Inert Environment)220.0°C
Linear Coefficient of Thermal Expansion (25°C)69.0ppm/°C
Thermal Conductivity (25°C)0.126W/mK
Specific Heat (20°C)0.2cal/g°C
Film Properties
ValueUnitsTest Method / Conditions
Nitrogen Gas Permeability (25°C)3.0(ccxmm)/(m²xdayxatm)
Oxygen Gas Permeability (25°C)15.4(ccxmm)/(m²xdayxatm)
Carbon Dioxide Gas Permeability (25°C)84.3(ccxmm)/(m²xdayxatm)
Hydrogen Gas Permeability (25°C)212.6(ccxmm)/(m²xdayxatm)
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Strength (25.4microns)276.0V/micron
Dielectric Strength (0.001”)25.4V/mil
Volume Resistivity (23°C, 50% RH)1.4x10¹⁷ohm-cm
Surface Resistivity (23°C, 50% Relative Humidity)1x10¹³ohms
Dielectric Constant (60Hz)2.65
Dielectric Constant (1KHz)2.65
Dielectric Constant (1MHz)2.65
Dielectric Constant (6GHz)2.54
Dielectric Strength (at 0.001”)7KV/mil
Dissipation Factor (60Hz)0.0002
Dissipation Factor (1KHz)0.0002
Volume Resistivity (at 23°C, 50% RH)1.4x10¹⁷ohm-cm
Dissipation Factor (1MHz)0.0006
Surface Resistivity (at 23°C, 50% Relative Humidity)1x10¹³ohms
Dissipation Factor (6GHz)0.0021 - 0.0028
Dielectric Constant (at 1MHz)2.65
Dissipation Factor (at 1MHz)0.0006
Chemical Resistance
ValueUnitsTest Method / Conditions
Hydrochloric Resistance (10%, Non-Oxidizing Acid, 25°C)0.0%
Hydrochloric Resistance (10%, Non-Oxidizing Acid, 75°C)0.0%
Hydrochloric Resistance (37%, Non-Oxidizing Acid, 25°C)0.2%
Hydrochloric Resistance (37%, Non-Oxidizing Acid, 75°C)2.3%
Sulfuric Resistance (10%, Non-Oxidizing Acid, 25°C)0.1%
Sulfuric Resistance (10%, Non-Oxidizing Acid, 75°C)0.2%
Sulfuric Resistance (95 - 98%, Non-Oxidizing Acid, 25°C)0.2%
Sulfuric Resistance (95 - 98%, Non-Oxidizing Acid, 75°C)5.3%
Nitric Resistance (10%, Non-Oxidizing Acid, 25°C)0.1%
Nitric Resistance (10%, Non-Oxidizing Acid, 75°C)0.2%
Nitric Resistance (71%, Non-Oxidizing Acid, 25°C)0.2%
Nitric Resistance (71%, Non-Oxidizing Acid, 75°C)Brittle
Chromic Resistance (10%, Non-Oxidizing Acid, 25°C)0.1%
Chromic Resistance (10%, Non-Oxidizing Acid, 75°C)1.2%
Chromic Resistance (74%, Non-Oxidizing Acid, 25°C)0.3%
Chromic Resistance (74%, Non-Oxidizing Acid, 75°C)8.2%
Sodium Hydroxide Resistance (10%, Base, 25°C)0.1%
Sodium Hydroxide Resistance (10%, Base, 75°C)0.0%
Ammonium Hydroxide Resistance (10%, Base, 25°C)0.3%
Ammonium Hydroxide Resistance (10%, Base, 75°C)0.4%
De - Ionized Water Resistance (100%, Inert, 25°C)0.0%
De - Ionized Water Resistance (100%, Inert, 75°C)0.0%
Isopropyl Resistance (Alcohol, 25°C)0.3%
Isopropyl Resistance (Alcohol, 75°C)0.3%
Iso - Octane Resistance (Aliphatic Hydrocarbon, 25°C)0.2%
Iso - Octane Resistance (Aliphatic Hydrocarbon, 75°C)0.3%
Pyridine Resistance (Amine, 25°C)0.2%
Pyridine Resistance (Amine, 75°C)0.4%
Xylene Resistance (Mixed, 25°C)1.4%
Xylene Resistance (Mixed, 75°C)2.1%
Trichloroethylene Resistance (TCE, 25°C)0.5%
Trichloroethylene Resistance (TCE, 75°C)0.7%
Chlorobenzene Resistance (Chlorinated Aromatic, 25°C)1.1%
Chlorobenzene Resistance (Chlorinated Aromatic, 75°C)1.7%
O-Dichlorobenzene Resistance (Chlorinated Aromatic, 25°C)0.2%
O-Dichlorobenzene Resistance (Chlorinated Aromatic, 75°C)0.3%
Trichlorotrifluoroethane Resistance (Fluorocarbon, 25°C)0.2%
Trichlorotrifluoroethane Resistance (Fluorocarbon, 75°C)0.2%
Acetone Resistance (Ketone, 25°C)0.3%
Acetone Resistance (Ketone, 75°C)0.4%
2,4-Pentanedione (Ketone, 25°C)0.6%
2,4-Pentanedione (Ketone, 75°C)0.7%

Regulatory & Compliance