company tower banner
Yincae Advanced Materials Company Logo

Yincae® BP 256

1 of 22 products in this brand
Yincae® BP 256 is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Product Type: Encapsulant

Application Area: Circuit Substrates, Semiconductors

Cure Method: Heat Cure

    Knowde Enhanced TDS

    Identification & Functionality

    Product Type

    Features & Benefits

    Ready-to-Use Product Features
    Features
    • Designed to enhance solder joint reliability and eliminate cleaning processes for ball bumping procedures
    • Ball bumping adhesive

    Applications & Uses

    Cure Method
    Product Application
    • Ball attachment
    • Provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner.
    Applying Method
    • Pin-transfer
    • Print

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Reflow Peak Temperature220 - 260°C
    Viscosity15 - 35kcp
    Coefficient of Thermal Expansion65.0