Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Features
- Designed to enhance solder joint reliability and eliminate cleaning processes for ball bumping procedures
- Ball bumping adhesive
Applications & Uses
- Applications
- Application Area
- Cure Method
- Product Application
- Ball attachment
- Provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner.
- Applying Method
- Pin-transfer
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Reflow Peak Temperature | 220 - 260 | °C | — |
Viscosity | 15 - 35 | kcp | — |
Coefficient of Thermal Expansion | 65.0 | — | — |