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Yincae® SMT 138E

1 of 22 products in this brand
Yincae® SMT 138E is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Product Type: Encapsulant

Application Area: Circuit Substrates, Semiconductors

Cure Method: Heat Cure

    Knowde Enhanced TDS

    Identification & Functionality

    Product Type

    Features & Benefits

    Features

    SnBi based adhesive offering rapid, low temp curing, self-leveling, and self-soldering

    Applications & Uses

    Cure Method
    Product Application
    • Low temperature solder paste replacement - Dispense
    • Provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner.
    Applying Method

    Dispense

    Properties

    Physical Form
    Typical Properties
    ValueUnitsTest Method / Conditions
    Reflow Peak Temperature140 - 185°C
    Viscosity50 - 100kcp
    Coefficient of Thermal Expansion23.5