Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Features
SnBi based adhesive offering rapid, low temp curing, self-leveling, and self-soldering
Applications & Uses
- Applications
- Application Area
- Cure Method
- Product Application
- Low temperature solder paste replacement - Dispense
- Provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner.
- Applying Method
Dispense
Properties
- Physical Form
- Typical Properties
Value | Units | Test Method / Conditions | |
Reflow Peak Temperature | 140 - 185 | °C | — |
Viscosity | 50 - 100 | kcp | — |
Coefficient of Thermal Expansion | 23.5 | — | — |