Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Features
Low temperature cure solder joint encapsulant adhesive.
Applications & Uses
- Applications
- Application Method
- Cure Method
- Applying Method
Dip
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
In-Line Curing Peak Temperature | 140 - 190 | °C | — |
Viscosity | 5 - 20 | kcp | — |
Coefficient of Thermal Expansion | 23.5 | — | — |