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Yincae® SMT 256L

1 of 22 products in this brand
Yincae® SMT 256L is a dip adhesive designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Product Type: Encapsulant

Application Area: Ball Grid Array (BGA), Chip Scale Packaging (CSP), Circuit Substrates, Semiconductors

Cure Method: Heat Cure

Application Method: Dip Coating

    Knowde Enhanced TDS

    Identification & Functionality

    Product Type

    Features & Benefits

    Ready-to-Use Product Features
    Features

    Low temperature cure solder joint encapsulant adhesive.

    Applications & Uses

    Application Method
    Cure Method
    Applying Method

    Dip

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    In-Line Curing Peak Temperature140 - 190°C
    Viscosity5 - 20kcp
    Coefficient of Thermal Expansion23.5