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Yincae® SMT 256TB

1 of 22 products in this brand
Yincae® SMT 256TB is a TCB adhesive designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Product Type: Encapsulant

Application Area: Ball Grid Array (BGA), Chip Scale Packaging (CSP), Circuit Substrates, Semiconductors

Cure Method: Heat Cure

Application Method: Dip Coating

    Knowde Enhanced TDS

    Identification & Functionality

    Product Type

    Features & Benefits

    Ready-to-Use Product Features

    Applications & Uses

    Application Method
    Cure Method
    Applying Method
    • Dip
    • Dispense
    • Jet

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    TCB Peak Temperature260.0°C
    Viscosity1 - 8kcp
    Coefficient of Thermal Expansion65.0
    Thermal Compression Bonding Pressure2.0N