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Yincae® SMT 266

1 of 22 products in this brand
Yincae® SMT 266 is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Product Type: Encapsulant

Application Area: Ball Grid Array (BGA), Chip Scale Packaging (CSP), Circuit Substrates, Semiconductors

Cure Method: Heat Cure

Application Method: Spray

    Knowde Enhanced TDS

    Identification & Functionality

    Product Type

    Features & Benefits

    Ready-to-Use Product Features
    Features

    First solder joint encapsulating adhesive.

    Applications & Uses

    Application Method
    Cure Method
    Product Application
    • High-temperature applications e.g. Pb free.
    • Provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner.
    Applying Method
    • Rework
    • Spray
    • Jet

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Reflow Peak Temperature230 - 260°C
    Viscosity6 - 10kcp
    Coefficient of Thermal Expansion65.0