Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Features
- Solderable conductive adhesive.
- Rapid cure, self-filling, self-leveling, and self-soldering adhesive.
Applications & Uses
- Applications
- Application Area
- Applying Method
Dispense
Properties
- Typical Properties
- Cured Properties
Value | Units | Test Method / Conditions | |
Viscosity | 20 - 50 | kcp | — |
Coefficient of Thermal Expansion | 23.5 | — | — |
Thermal Conductivity | 60.0 | W/mK | — |
Value | Units | Test Method / Conditions | |
Curing Conditions (150°C) | 30.0 | minutes | — |