Products

Zymet CSP-1412 is designed for BGA, CSP, and WL-CSP encapsulation. These packages are not typically encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.

Zymet CN-1453 is a new reworkable BGA underfill encapsulant. It is a silica filled version.

Zymet UVE-1017-2 cures in as little as 3 minutes, far less time than a conventional heat cured encapsulant. The fast cure increases line speed and productivity.

Zymet CN-1703 is designed for CSP and BGA encapsulation. CSP’s and BGA’s are not normally encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations.