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Features & Benefits
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UVE-1017-2 is sensitive to 365 nm broadband radiation, otherwise known as the UV-A spectrum. Since this is the longer UV spectra, cure depths of 60-100 mils are easily achieved. Curing equipment is available from several independent vendors.
The encapsulant is suited for glob-top encapsulation. Its typical viscosity is only 50,000 cps at 68°C, even lower at higher temperatures, facilitating flow and wetting. Its thixotropy permits a dome-shaped globe. The average particle size of the filler is between 10-20 microns, with a maximum particle size of 50 microns, permitting the encapsulant to flow between narrowly spaced wire bonds.
In a chip-on-flex application, IC assemblies encapsulated with UVE-1017-2 have passed rigorous tests, including thermal shock, thermal cycle, 85°C/85%RH, and pressure cooker testing. Contributing to the excellent results are the encapsulant’s low coefficient of thermal expansion (17.5 ppm/°C), its high glass transition temperature (145°C), its excellent adhesion to organic substrates, including polyimide, and its low level of ionic contaminants.
Applications & Uses
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