Toray
Toray MicroPly™ ES72A-2
Function: Core Material
Toray Toray MicroPly™ ES72A-2 is a 125°C (257°F) curing low-density, expanding, unsupported, epoxy syntactic core. ES72A-2 offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin-walled composite sandwich structures. ES72A-2 can be easily contoured and shaped. Toray MicroPly™ ES72A-2 expands using a closed cell process ensuring complete homogeneous cell structure, the density/strength may be altered simply by changing cure pressure or limiting the volume available for expansion, the material is capable of expanding up to 650%. Toray MicroPly™ ES72A-2, formerly Amspand, is available in a variety of thicknesses down to 1 mm, and is supplied in sheets (625 mm x 400 mm).