Consumer Goods

The Mitsubishi Chemical Group

jER™ YX7105

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YX8000D

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YL980

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ Epoxy YX7110

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YX4000

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YX8040

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YL983U

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YX7400N

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Sika

Sika RSF 816 G

Sika RSF 816 G can be combined with natural fibers and fabrics such as flax, hemp or cellulose based materials fo greener composite solutions.

Sika

Biresin® CR131

Biresin® CR131 is an epoxy resin system suitable for the production of high performance fiber reinforced composites parts and molds with thermal properties up to 130°C.

The Mitsubishi Chemical Group

jER™ 1750

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Scott Bader

Crystic® Laminating Resin 4252.4 TEPA V01

Crystic® Laminating Resin 4252.4 TEPA V01 is an orthophtalic, pre-accelerated, low styrene emission (LSE), thixotropic unsaturated polyester resin. This product can be used for spray application or for contact molding when fast mold turn-around or thick laminates are required. It is an incredibly versatile laminating resin, and its excellent mechanical properties make it ideal for bonding on acrylic sheets for sanitary use.

Barrday

Barrday Thermoplastic Systems

Lightweight, cost competitive and ballistically superior, Barrday’s thermoplastic resin based products can be molded into complex 3D shapes and reshaped using high temperatures. Their excellent ballistics properties make thermoplastics ideal for a wide range of applications including stab resistant materials and composite armors. Ballistic panels made using these resins can be used as either as stand-alone structures or in combination with steel or ceramic in personal or vehicle armor.

Sika

Biresin® CR201

Biresin® CR201 is a three component, anhydride cured, low viscosity epoxy resin system suitable for the production of high performance fi bre reinforced composites with outstanding heat resistance.

Sika

Biresin® CR144

Biresin® CR144 is a three component, anhydride cured, low viscosity epoxy resin system suitable for the production of high performance fi bre reinforced composites.

Scott Bader

Crystic® Spray Gelcoat 92PA

Crystic® Spray Gelcoat 92PA is a chemical resistant spray gelcoat. It is suitable for the manufacture of bathroom products such as sinks, baths, shower trays and water slides and has been used successfully in the industry for many years. It is easy to use and repair.

Scott Bader

Crystic® Polyester Resin 990PA

Crystic® Polyester Resin 990PA is a pre-accelerated, low-viscosity, modified orthophthalic polyester resin containing styrene and methyl methacrylate. It was developed for use as a filled system in reinforcing ABS acrylic-lined baths, sinks, and shower trays and is designed for spray laminating. This product has a 6-minute gel time.

Polymer Resources Ltd.

Polymer Resources Ltd. PRL PPX-G5

Xenia

XECARB® 11-C20-HP

XECARB® 11-C20-HP is a 20% carbon fiber reinforced PP

Polymer Resources Ltd.

Polymer Resources Ltd. PRL PPX-MF-FRG20

Barrday

Barrday Phenolic Systems

Phenolic resins are renowned for their excellent high temperature resistance, flame resistance, low smoke generation and low toxicity in fire situations. Phenolics are used in vehicle armor applications that utilize these properties in combination with E-glass and other high performance glass fibers. Phenolics are very rigid, although toughened versions are available with reduced temperature resistance.

Polynt Group

OPTIPLUS

OPTIPLUS - Mold construction. Allows high glass fabric content. Infusion processing possible. Suitable for higher temperature applications.. Main Applications areas are Building and Construction,Electronic and Electrical,Home and Domestic Applications,Industrial sector,Mass Transports,Railway Sector etc.

MITO Material Solutions

MITO® E-GO™ RES-1

MITO® E-GO™ RES-1 is a laminating epoxy resin powered with our flagship product MITO® E-GO, a modified graphene oxide additive that makes graphene easy to use and accessible to all.   Designed for Compression molding applications for high-performance sporting goods, it boosts the performance of fiber-reinforced applications, resulting in significantly improved durability while maintaining a lighter weight. Secondary properties such as damping, thermal conductivity, and resistivity are also expected.   This product is sold as a kit consisting of 1 gallon of Resin loaded with 1% of MITO® E-GO® and 1 quart of MITO® standard accompanying hardener. Graphene Council Mito Materials provides in-resin graphene additive for composites Mito Materials provides in-resin graphene additive for composites

BTC Europe GmbH

Kauramin Powder 630

BTC Europe GmbH

Kauramin Powder 651

Wacker Chemie AG

SILRES® H62 C

SILRES® H62 C is a liquid, solvent-free one-part heat-curing phenyl silicone resin formulation. The product is ideal to impregnate electrical coils of motors and generators. Besides SILRES® H62 C can be used to provide hydrophobic properties to porous materials and as binder for composites made of fibrous fillers, cloths, woven or non-woven reinforcing materials. The formulation is ready-to-use and crosslinks under heat. While curing SILRES® H62 C does not release chemical byproducts, and hence a curing shrink is barely noticeable. The product also thermosets in thick layers, even when in contact with air. Fully cured SILRES® H62 C has excellent electrical insulation properties and outstanding long-term heat resistance. It additionally shows high stability against weathering, moisture and UV light, and it can therefore be exposed continuously to constantly changing climatic conditions or UV radiation.

Wacker Chemie AG

SILRES® K

SILRES® K is a solution of a condensation curing methyl silicone resin in toluene. The product can be used as a binder or as an impregnation agent for porous materials. Besides SILRES® K is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® K has a very low carbon content and thus yields a high ash content when pyrolized. Composites made of SILRES® K show long-term stability against weathering, moisture and UV light; they can therefore be exposed continuously to constantly changing climatic conditions, UV radiation and temperatures significantly higher than 300 °C (572 °F). SILRES® K further provides water repellency and excellent electrical insulation properties to the respective composite materials.

Wacker Chemie AG

SILRES® H 44

SILRES® H44 is a powdered, condensation curing phenyl silicone resin with excellent solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Due to its compatibility with organic resins, SILRES® H44 can also be used to modify, or to partly replace, phenolic resins in the respective compounds. Compared to other silicone resins SILRES® H44 cures relatively fast at elevated temperature. It is therefore particularly suitable for fully automated production lines.

Wacker Chemie AG

SILRES® MK Flakes

SILRES® MK FLAKES is a condensation curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Besides SILRES® MK FLAKES is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® MK FLAKES has the lowest carbon content of all WACKER silicone resins and thus yields a very high ash content when pyrolized. Composites made of SILRES® MK FLAKES show long-term stability against weathering, moisture and UV light; they can therefore be exposed continuously to constantly changing climatic conditions, UV radiation and temperatures significantly higher than 300 °C (572 °F). SILRES® MK FLAKES further provides water repellency and excellent electrical insulation properties to the respective composite materials.

Wacker Chemie AG

SILRES® MK Powder

SILRES® MK POWDER is a condensation curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Besides SILRES® MK POWDER is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES MK POWDER has the lowest carbon content of all WACKER silicone resins and thus yields a very high ash content when pyrolized. Composites made of SILRES® MK POWDER show long-term stability against weathering, moisture and UV light; they can therefore be exposed continuously to constantly changing climatic conditions, UV radiation and temperatures significantly higher than 300 °C (572 °F). SILRES® MK POWDER further provides water repellency and excellent electrical insulation properties to the respective composite materials.

Envalior

EcoPaXX® Q-HG6

DSM Engineering Materials EcoPaXX® Q-HG6 is a long aliphatic polyamide with excellent chemical and hydrolysis resistance. It is suitable for thermal management applications and other structural parts. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It is heat stabilized and contains 30% glass reinforcement.

Envalior

Akulon® K224-LGM35

DSM Engineering Materials Akulon® K224-LGM35 is a high-performance polyamide 6 and polyamide 66 material used in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. For extrusion, the strength, resilience, and easy processing of this product set the market standards. The recommended processing technology is injection molding. Special features include being U.V. stabilized or stable to weather, 15% glass reinforced, and 25% mineral reinforced.

Envalior

Akulon® Ultraflow K-FHG6/B

DSM Engineering Materials Akulon® Ultraflow K-FHG6/B is a high-performance polyamide 6 and polyamide 66 material used by customers across the world in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile, for extrusion, the strength, resilience, and easy processing of this product set the market standards. The best-suited processing technology is injection molding, and special features include 30% glass reinforcement, heat stabilization, high flow, and improved processing.

Envalior

ForTii® Ace MX53

DSM Engineering Materials ForTii® Ace MX53 is a polyphthalamide (PPA) with unique fatigue performance and chemical resistance. Its high aromatic content and high Tg lead to excellent part stiffness and low creep, even at temperatures up to 150°C. Moisture uptake occurs slowly, with minimal impact on dimensions. ForTii® Ace MX53 is processed using injection molding technology and is heat stabilized. It is 50% glass-reinforced and suitable for automotive applications.

Envalior

Akulon® K224-HGM35

DSM Engineering Materials Akulon® K224-HGM35 is a high-performance polyamide 6 and polyamide 66 material used in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing, along with outstanding mechanical properties over a wide temperature range and in diverse conditions. For extrusion, the strength, resilience, and easy processing of this product set the market standards. The recommended processing technology is injection molding. It features 15% glass reinforcement and 25% mineral reinforcement. It is also heat stabilized.

Envalior

EcoPaXX® Q-KG6-FC

DSM Engineering Materials EcoPaXX® Q-KG6-FC is a bio-based, high-performance polyamide (PA410) made mainly from tropical castor beans that do not compete with the food chain. It offers excellent processability and surface quality, and it is safe for use in a broad variety of food contact applications. Belonging to the family of long-chain polyamides, it provides exceptional performance in demanding environments, including excellent chemical resistance, low moisture absorption, a very high melting point (highest among bio-plastics), and a high crystallization rate. This grade is processed using injection molding and includes 30% glass reinforcement, meeting food contact quality standards.