Electrical & Electronics

The Mitsubishi Chemical Group

jER™ YX7105

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YX8000D

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ 4250

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YL980

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ Epoxy YX7110

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YX4000

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YX8040

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ 1256

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YL983U

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

The Mitsubishi Chemical Group

jER™ YX7400N

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Sika

Biresin® CR131

Biresin® CR131 is an epoxy resin system suitable for the production of high performance fiber reinforced composites parts and molds with thermal properties up to 130°C.

The Mitsubishi Chemical Group

jER™ 1750

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Sika

Biresin® CR144

Biresin® CR144 is a three component, anhydride cured, low viscosity epoxy resin system suitable for the production of high performance fi bre reinforced composites.

Sika

Biresin® CR201

Biresin® CR201 is a three component, anhydride cured, low viscosity epoxy resin system suitable for the production of high performance fi bre reinforced composites with outstanding heat resistance.

Polymer Resources Ltd.

Polymer Resources Ltd. PRL PPX-MF-FRG20

Polymer Resources Ltd.

Polymer Resources Ltd. PRL PPX-G5

Polynt Group

OPTIPLUS

OPTIPLUS - Mold construction. Allows high glass fabric content. Infusion processing possible. Suitable for higher temperature applications.. Main Applications areas are Building and Construction,Electronic and Electrical,Home and Domestic Applications,Industrial sector,Mass Transports,Railway Sector etc.

Wacker Chemie AG

SILRES® H62 C

SILRES® H62 C is a liquid, solvent-free one-part heat-curing phenyl silicone resin formulation. The product is ideal to impregnate electrical coils of motors and generators. Besides SILRES® H62 C can be used to provide hydrophobic properties to porous materials and as binder for composites made of fibrous fillers, cloths, woven or non-woven reinforcing materials. The formulation is ready-to-use and crosslinks under heat. While curing SILRES® H62 C does not release chemical byproducts, and hence a curing shrink is barely noticeable. The product also thermosets in thick layers, even when in contact with air. Fully cured SILRES® H62 C has excellent electrical insulation properties and outstanding long-term heat resistance. It additionally shows high stability against weathering, moisture and UV light, and it can therefore be exposed continuously to constantly changing climatic conditions or UV radiation.

Wacker Chemie AG

SILRES® H 44

SILRES® H44 is a powdered, condensation curing phenyl silicone resin with excellent solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Due to its compatibility with organic resins, SILRES® H44 can also be used to modify, or to partly replace, phenolic resins in the respective compounds. Compared to other silicone resins SILRES® H44 cures relatively fast at elevated temperature. It is therefore particularly suitable for fully automated production lines.

Wacker Chemie AG

SILRES® MK Flakes

SILRES® MK FLAKES is a condensation curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Besides SILRES® MK FLAKES is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® MK FLAKES has the lowest carbon content of all WACKER silicone resins and thus yields a very high ash content when pyrolized. Composites made of SILRES® MK FLAKES show long-term stability against weathering, moisture and UV light; they can therefore be exposed continuously to constantly changing climatic conditions, UV radiation and temperatures significantly higher than 300 °C (572 °F). SILRES® MK FLAKES further provides water repellency and excellent electrical insulation properties to the respective composite materials.

Wacker Chemie AG

SILRES® MK Powder

SILRES® MK POWDER is a condensation curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Besides SILRES® MK POWDER is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES MK POWDER has the lowest carbon content of all WACKER silicone resins and thus yields a very high ash content when pyrolized. Composites made of SILRES® MK POWDER show long-term stability against weathering, moisture and UV light; they can therefore be exposed continuously to constantly changing climatic conditions, UV radiation and temperatures significantly higher than 300 °C (572 °F). SILRES® MK POWDER further provides water repellency and excellent electrical insulation properties to the respective composite materials.

Wacker Chemie AG

SILRES® K

SILRES® K is a solution of a condensation curing methyl silicone resin in toluene. The product can be used as a binder or as an impregnation agent for porous materials. Besides SILRES® K is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® K has a very low carbon content and thus yields a high ash content when pyrolized. Composites made of SILRES® K show long-term stability against weathering, moisture and UV light; they can therefore be exposed continuously to constantly changing climatic conditions, UV radiation and temperatures significantly higher than 300 °C (572 °F). SILRES® K further provides water repellency and excellent electrical insulation properties to the respective composite materials.

Envalior

Akulon® Ultraflow K220-HGM44

DSM Engineering Materials Akulon® Ultraflow K220-HGM44 is a high-performance polyamide 6 and polyamide 66 material used by customers across the world in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile, for extrusion, the strength, resilience, and easy processing of this product set the market standards. Injection molding is the best-suited processing technology for this product, featuring 20% glass-reinforced, 20% mineral-reinforced, and heat-stabilized materials.

Envalior

Akulon® Ultraflow K-FKMV5

DSM Engineering Materials Akulon® Ultraflow K-FKMV5 is a family of high-performance polyamide 6 and polyamide 66 materials used by customers across the world in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile, for extrusion, the strength, resilience, and ease of processing of the product set the market standards. A suitable processing technology for the product is injection molding. Special features include good or high flow.

Envalior

Akulon® K224-HGM35

DSM Engineering Materials Akulon® K224-HGM35 is a high-performance polyamide 6 and polyamide 66 material used in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing, along with outstanding mechanical properties over a wide temperature range and in diverse conditions. For extrusion, the strength, resilience, and easy processing of this product set the market standards. The recommended processing technology is injection molding. It features 15% glass reinforcement and 25% mineral reinforcement. It is also heat stabilized.

Envalior

Akulon® K20HG60

DSM Engineering Materials Akulon® K20HG60 is a black, unidirectional tape that is composed of 60% continuous glass fiber reinforcement. Processing technologies such as lamination, thermoforming, and winding are applicable for this product. It is primarily utilized in the manufacturing of structural parts for robotics.

Envalior

Akulon® Ultraflow K-FHGM24

DSM Engineering Materials Akulon® Ultraflow K-FHGM24 is a high-performance polyamide 6 and polyamide 66 material used by customers across the world in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile, for extrusion, the strength, resilience, and easy processing of this product set the market standards. The best-suited processing technology is injection molding, and special features include 10% glass reinforcement, 20% mineral reinforcement, heat stabilization, and high flow.

Envalior

Akulon® K222-KGV4

DSM Engineering Materials Akulon® K222-KGV4 is a high-performance polyamide 6 and polyamide 66 material utilized in applications such as automotive, electronics, electrical, furniture, and packaging. In molded parts, this material offers an excellent balance of easy design and processing, along with outstanding mechanical properties over a wide temperature range and diverse conditions. For extrusion, it sets market standards with its strength, resilience, and easy processing. It features special properties such as phosphorous-free, 20% glass reinforcement, heat stabilization, and halogen-phosphorous-free flame retardancy. The processing technology for this material is injection molding.

Envalior

Akulon® SG-KGS6/HV

DSM Engineering Materials Akulon® SG-KGS6/HV is a high-performance polyamide 6 and polyamide 66 material used by customers across the world in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile, for extrusion, the strength, resilience, and easy processing of this product set the market standards. The special features of the product include 30% glass reinforcement, high flow, being halogen-free, and being free of red phosphorous.

Envalior

Akulon® K224-HG7

DSM Engineering Materials Akulon® K224-HG7 is a high-performance polyamide 6 and polyamide 66 material used in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing, along with outstanding mechanical properties over a wide temperature range and in diverse conditions. For extrusion, the strength, resilience, and easy processing of this product set the market standards. The recommended processing technology is injection molding. It features 35% glass reinforcement and is heat stabilized.

Envalior

Akulon® SG-KGS6

DSM Engineering Materials Akulon® SG-KGS6 is a high-performance polyamide 6 and polyamide 66 material used by customers across the world in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile, for extrusion, the strength, resilience, and easy processing of this product set the market standards. Injection molding is the best-suited processing technology for this application, featuring 30% glass reinforcement, halogen-free material, and no red phosphorous.

Envalior

Akulon® RePurposed RE15 BK00003

DSM Engineering Materials Akulon® RePurposed RE15 BK00003 is a high-performance polyamide 6 and polyamide 66 material used by customers across the world in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile, for extrusion, the strength, resilience, and easy processing of this product set the market standards. It is 15% glass-reinforced, contains recycled content, and is best suited for injection molding.

Envalior

Akulon® K20HC60

DSM Engineering Materials Akulon® K20HC60 is a black, unidirectional tape that offers 60% continuous carbon fiber reinforcement and is heat stabilized. This product can be processed using various technologies, including lamination, thermoforming, and winding. The polymer used in this tape is Polyamide 6 (PA 6). It finds application in the field of robotics, among other end uses.

Envalior

Akulon® Ultraflow K-FKG8

DSM Engineering Materials Akulon® Ultraflow K-FKG8 is a high-performance polyamide 6 and polyamide 66 material used by customers across the world in applications ranging from automotive, electronics, and electrical to furniture and packaging. In molded parts, the material offers an excellent balance of easy design and processing with outstanding mechanical properties over a wide temperature range and in diverse conditions. Meanwhile, for extrusion, the strength, resilience, and easy processing of this product set the market standards. The best-suited processing technology is injection molding, and special features include 40% glass reinforcement, heat stabilization, and high flow.

Envalior

Akulon® K222-KMV5

DSM Engineering Materials Akulon® K222-KMV5 is a high-performance polyamide 6 and polyamide 66 material used in automotive, electronics, electrical, furniture, and packaging applications around the world. This material provides an excellent balance of design flexibility and processability, along with outstanding mechanical properties over a wide temperature range and in diverse conditions. It meets market standards for extrusion with its strength, resilience, and easy processing. The material is heat stabilized, features 25% mineral reinforcement, and provides halogen-free flame retardancy. Injection molding is the recommended processing technology.

Envalior

Akulon® K222-KGMV14

DSM Engineering Materials Akulon® K222-KGMV14 is a high-performance polyamide 6 and polyamide 66 material employed in applications such as automotive, electronics, electrical, furniture, and packaging. In molded parts, this material offers an excellent balance of easy design and processing, along with outstanding mechanical properties over a wide temperature range and diverse conditions. For extrusion, it sets market standards with its strength, resilience, and easy processing. It features special properties such as phosphorous-free, 5% glass reinforcement, 20% mineral reinforcement, heat stabilization, and halogen-phosphorous-free flame retardancy. The processing technology for this material is injection molding.