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End Uses: Radiation Curable Coating
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Mitsubishi Chemical Group banner
Mitsubishi Chemical Group logo

Mitsubishi Chemical Group

jER™ YX8000D

Polymer Name: Epoxy Resins & Compounds
Function: Coupling Agent, Binder, Adhesion Promoter
Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Olin Corporation banner
Olin Corporation logo

Olin Corporation

D.E.R.™ 332

Chemical Family: Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy, Bisphenol Epoxy Resins
End Uses: Epoxy Adhesive & Sealant, Radiation Curable Coating
Compatible Substrates & Surfaces: Composites
Features: Low Viscosity

D.E.R.T 332 Epoxy Resin is a high purity bisphenol A diglycidylether. The uniqueness of D.E.R. 332 Liquid Epoxy Resin is reflected in its maximum epoxy equivalent weight of 176 grams/equivalent (the chemically pure diglycidylether of bisphenol A has an epoxy equivalent weight of 170 g/eq). Because of its high purity and low polymer fractions content, D.E.R. 332 Epoxy Resin assures uniform performance and exceptionally low viscosity, low chloride content and light color. Under some cure conditions this epoxy resin provides improved elevated temperature properties over standard bisphenol A based epoxy resins such as D.E.R.“ 331“ Epoxy Resin for example. D.E.R. 332 Epoxy Resin is used mainly in filament winding, electrical laminates and encapsulation applications. A wide variety of curing agents is available to cure this liquid epoxy resin at ambient conditions. Most frequently used curing agents are cycloaliphatic polyamines, polyamides, amidoamines, and modified versions of these. Curing may also be done at an elevated temperature to improve selected properties such as chemical resistance and glass transition temperature. Elevated temperature cures are necessary and long post-cures are required to develop full end properties if anhydride or catalytic curing agents are employed.

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