company tower banner
A&C Catalysts Company Logo
Resicure® D-5 is a pulverized grade of dicyamdiamide with an average particle size of about 5 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Technicure® D-5 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted ureas such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability.

Functions: Curing Agent

Chemical Family: Amides

End Uses: 1K (1 Component) Adhesive, Powder Coating

Compatible Polymers & Resins: Epoxies (EP)

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Chemical Family
CASE Ingredients Functions
Technologies

Features & Benefits

Advantages
  • Long formulation shelf stability
  • High glass transition temperature
  • Excellent adhesion to a variety of substrates
  • Can be used with an accelerator

Applications & Uses

Compatible Polymers & Resins
Adhesive & Sealant Type
Coating Type
Application
  • One-component adhesives for auto, aerospace and electronics applications
  • Composites such as pre-pregs
  • Powder coatings

Properties

Physical Form
Appearance
White micronized powder
Typical Properties
ValueUnitsTest Method / Conditions
Moisture ContentMax. 0.5%
Assay99%
Average Particle Size5micron
Melting Point207- -211°C