Products

Technirez® NC-36 is adduct of a semi-solid epoxy novolac resin and a carboxyl terminated butadiene acrylonitrile elastomer. NC-36 is used with epoxy resins to improve toughness, adhesion and fatigue resistance while maintaining thermal properties.

Technicure® LC-100 is a modified polymeric tertiary amine designed for one-component epoxy formulations. The product can be used as a sole curing agent or as an accelerator for dicyandiamide, anhydride, and dihydrazides. As an accelerator for anhydride curing agent, the product offers excellent reactivity, long shelf life and high glass transition temperature.

TECHNIREZ® RME-912 is a solid adduct of a “4” type solid diglycidyl ether of bisphenol-A epoxy resin and a carboxyl terminated butadiene acrylonitrile elastomer. RME-912 is epoxy functional and therefore compatible with all epoxy resins. The product offers low temperature melting and high elastomer content. RME-912 is easily dissolved in a variety of solvents such as MEK, toluene and xylene. Due to its high elastomeric content, significant improvements in impact resistance, thermal shock resistance and fatigue resistance may be seen when used alone or in combination with other epoxy resins. The product is offered as a coarse pellet or as a fine ground (180 micron) powder or as superfine 74 micron grade.

Technicure® MDU-11M, [4,4’- (methylene bis (phenyl dimethyl)] urea, is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Resicure® 2MI is commonly used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Typical loading level as a sole curing agent is about 3-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 1.5 phr. Jet milled grade of Resicure imidazole is available as Resicure 2MI-J.

Resicure® EMI-24 is commonly used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Typical loading level as a sole curing agent is about 1-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 3.0 phr. Resicure EMI-24 LV is a lower viscosity version of Resicure EMI-24.

Technicure® TDU-200M is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Technicure® PDU-250M, N,N-dimethyl-N-phenyl urea, is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Technicure® DCMU is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability.

Technicure® D-10 is a pulverized grade of dicyandiamide with an average particle size of about 10 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Technicure® D-10 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted urea such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability. Technicure® D-10 is available without fumed silica or with a different flow control agent.

Resicure® D-5 is a pulverized grade of dicyamdiamide with an average particle size of about 5 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Technicure® D-5 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted ureas such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability.

Technicure® 101 is an Imidazole Epoxy Adduct Curing Agent.

Technicure® IPDU-8, N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. It is used as a dicyandiamide (DICY) accelerator in one-component epoxy resin based formulations. Typically the product is used with epoxy resin and dicyandiamide between 1-3 phr. The loading level of an accelerator will provide balance of low temperature reactivity and formulation shelf stability. Among all substituted ureas as DICY cure accelerators, IPDU-8 offers the most latency.

Technicure® D-44 is a pulverized grade of dicyandiamide with an average particle size of about 20 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Due to larger particle size, the products offers lower exothermic heat than the finer grade of Dicy. Technicure® D-44 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted ureas such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability.