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Technicure® D-10

1 of 29 products in this brand
Technicure® D-10 is a pulverized grade of dicyandiamide with an average particle size of about 10 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Technicure® D-10 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted urea such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability. Technicure® D-10 is available without fumed silica or with a different flow control agent.

Functions: Curing Agent

Chemical Family: Amides

End Uses: 1K (1 Component) Adhesive, Powder Coating

Compatible Polymers & Resins: Epoxies (EP)

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Chemical Family
CASE Ingredients Functions
Technologies

Features & Benefits

Advantages
  • Long formulation shelf stability
  • High glass transition temperature
  • Excellent adhesion to a variety of substrates
  • Can be used with an accelerator

Applications & Uses

Compatible Polymers & Resins
Adhesive & Sealant Type
Coating Type
Applications
  • One-component adhesives for auto, aerospace and electronics applications
  • Composites such as pre-pregs
  • Powder coatings

Properties

Physical Form
Appearance
White micronized powder
Typical Properties
ValueUnitsTest Method / Conditions
Moisture ContentMax. 0.5%
Assay99%
Average Particle Size10micron
Melting Point207- -211°C