Products

Resicure® EMI-24 is commonly used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Typical loading level as a sole curing agent is about 1-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 3.0 phr. Resicure EMI-24 LV is a lower viscosity version of Resicure EMI-24.

Resicure® 2MI is commonly used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Typical loading level as a sole curing agent is about 3-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 1.5 phr. Jet milled grade of Resicure imidazole is available as Resicure 2MI-J.

Technicure® 54 is commonly used as a cure accelerator in epoxy resin based formulations. Typical loading level as an accelerator is about 0.5 to 8 phr in a standard DGEBA type liquid epoxy resin EEW=190) based formulation.

Technicure® D-44 is a pulverized grade of dicyandiamide with an average particle size of about 20 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Due to larger particle size, the products offers lower exothermic heat than the finer grade of Dicy. Technicure® D-44 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted ureas such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability.