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Resicure® 2MI is commonly used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Typical loading level as a sole curing agent is about 3-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 1.5 phr. Jet milled grade of Resicure imidazole is available as Resicure 2MI-J.

Functions: Catalyst, Curing Agent

CAS Number: 693-98-1

Compatible Polymers & Resins: Epoxies (EP)

Features: Chemical Resistance

Synonyms: 1H-2-Methylimidazole, 2-Methyl-1H-imidazole

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Chemical Name
CASE Ingredients Functions
CAS No.
693-98-1
EC No.
211-765-7
Technologies
Chemical Structure

Resicure® 2MI - Chemical Structure

Features & Benefits

CASE Ingredients Features
Advantages
  • High reactivity at temperature <100°C
  • High glass transition temperature
  • High chemical resistance

Applications & Uses

Compatible Polymers & Resins
Adhesive & Sealant Type
Coating Type
Applications
  • One-component adhesives for auto, aerospace and electronics applications
  • Composites such as pre-pregs and filament winding
  • Electrical potting and encapsulation
  • Powder coatings

Properties

Physical Form
Appearance
Yellow to white micronized powder
Typical Properties
ValueUnitsTest Method / Conditions
Recommended use level with Epoxy resin (EEW=190)3-5 PHR
Assaymin. 99%
Average Particle Size10micron
Melting Point140 - 145°C
Moisture ContentMax. 0.5%