Knowde Enhanced TDS
Identification & Functionality
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Product Features
- Non-flammable
- Non-ozone depleting
- Low VOC; low odor
- Safe on warm ovens
- Halide-free; prevents ionic contamination
- IPA-free
Applications & Uses
- Markets
- Application Area
- Application Method
- Compatible Substrates & Surfaces
- Ideal for the Following Applications
- Removing baked-on flux from SMT ovens and wave solder equipment
- Solder pallet cleaning
- Selective solder nozzle cleaning
- Directions
Reflow Oven Cleaning: Test on a non-critical area to ensure material and product compatibility. Avoid using on aluminum, copper, brass, carbon steel, and galvanized steel.
Allow oven to cool down slightly and apply on warm surface. Do not use at temperatures above 212°F/100°C. Spray and saturate the soiled area. Let soak for 5 minutes. Using lint-free wipes, wipe in a circular motion until flux residues are fully removed. Wipe completely with water-dampened cloth to remove any remaining residues.
Wave Solder Finger Cleaning: Pour cleaner into finger cleaning reservoir. Keep fluid level adequately maintained.
Properties
- Physical Form
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Packaging Information
- Product# 8697: 32 fl oz (946 ml) / 6 quarts per case