- Applications:Semiconductor Manufacturing, Exterior & Body, Aftermarket Parts & Components
- Product Families:Polyamides, Engineering & Specialty Polymers
- Chemical Family:Carbon Fiber, Polyamides
- Polymer Name:Polyamide (unspecified)
- End Uses:Semiconductor Applications, Automotive Exterior Parts, Automotive Components
High modulus PA compound reinforced with carbon fibers, Particulary suitable for structural parts, Low density for weight savings approach. Resistivity 108. For SDS, please contact Addiplast Group using the 'Request Document' button.