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AI Technology HTCR 250 (Single-Sided)

Product Type: Dicing Tape

Application Area: Wafer Bonding

Compatible Substrates & Surfaces: Ceramic, Glass

Features: Anti-Static, Good Adhesion, Good Peeling Strength

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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Labeling Claims

Applications & Uses

Application Area
Compatible Substrates & Surfaces

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Peel Strength250g/inch-
Adhesive Thickness25microns-
Substrate Thickness100microns-
Elongationmin. 100%-
Tensile Strengthmin. 200Kg/cm-

Regulatory & Compliance

Certifications & Compliance