Products

TP7205 is an alumina filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. TP7205 has good thermal conductivity and is tacky at room temperature. The adhesive film typically can be used for most applications at temperature from -65 to 150°C. Customers must test the adhesive for their specific application to confirm its suitability.

TP8205 is a silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.

TP 7205 is an alumina filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. TP 7205 has good thermal conductivity and is tacky at room temperature. The adhesive film typically can be used for most applications at temperature from -65 to 150C. Customers must test the adhesive for their specific application(s) to confirm its suitability.

TP7209 is a low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. This unique diamond flled material has excellent thermal conductivity and is tacky at room temperature.