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AI Technology RTK 7554

Product Type: Thermal Adhesive

Application Area: Die/Chip Attach, LEDs

    Knowde Enhanced TDS

    Identification & Functionality

    Product Type

    Features & Benefits

    Applications & Uses

    Application Area

    Properties

    Flame Rating
    Typical Properties
    ValueUnitsTest Method / Conditions
    Thermal Conductivitymin. 0.2W/m-°C
    Thermal Conductivitymin. 8W/m-°C
    Dielectric Strengthmin. 300Volts/mil
    Device Push Off Strengthmin. 1000psi
    Cured Density2.5g/cc
    Maximum Continuous Operation Temperaturemin. 150°C
    Electrical Resistivitymin. 10¹⁴Ω-cm

    Regulatory & Compliance