Products

ME 7650-RC is a low viscosity version of ME7150 for snap curing applications. It is a reworkable, unfilled, electrically insulating, and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible characteristic of this material makes it useful for bonding high-powered, large area dies and components. ME 7650-RC can be cured rapidly at 150-180°C for approximately 60 seconds without creating voids. It can be readily reworked at 80-100°C.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

EG7655 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). EG7655's high thermal conductivity and flexibility make it excellent for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80-100°C for easier rework. The cured adhesive is flexible with Type A hardness of 80 and tensile elongation of more than 30%.

RTK7659 is a tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged, dielectric adhesive offers excellent reworkability at 80-150°C. RTK7659 has excellent thermal conductivity and the low Tg of the adhesiveimposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

ME7863 is a one part, quartz filled cyanate ester die attach adhesive. It was designed for solder-sealed ceramic packages. It can withstand temperatures up to 300°C without thermal degradation. ME7863 has processing characteristics required in high speed automation. Its unique chemistry results in very low moisture absorption, high adhesive strength and low CTE.

EG7635 is a alumina filled, electrically insulating and thermally conductive rigid epoxy paste adhesive. While bonding at ambient temperature can be achieved overnight, elevated temperatures will accelerate curing, exponentially. EG7635 high thermal conductivity and high strength makes it excellent for bonding substrates, components and heat sinks where thermal management is critical. It has more than 15 years of proven records of providing bonding to difficult substrates. EG7635 exibits reduced bond strength at 80-100°C for easier rework.

ESP7666-FOW is the modified boron nitride filled thermally conductive version of the high flow DAF of ESP7660-FOW. It is a high-bond strength epoxy film adhesive tor high flow when melted to easily flow over Wire-bond in stack chip die attach application. This new generation wafer level die- attach film is flexible before curing. This ESP7660-FOW is mounted onto the back of the wafer at 80-100°C, which is then diced into predetermined sizes using standard dicing tape. Depending on the different dicing tape used and with suitable releasing action such as UV or heat, the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-FOW has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

TP7155 is an aluminum oxide filled, medium bond strength thermoplastic film adhesive designed for bonding die, component, and substrate. It has good thermal conductivity. The dry, tack-free handling of the film makes it suitable for automated assembly. TP7155 is designed for bonding parts that may be operaung at 160 continuously. If excessive tensile stress is expected at temperature above 150°C, additional mechanical support may be considered.

Tack-film TK7758 is a reworkable, aluminum nitride-filled, electrically insulating epoxy film adhesive. It is designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged conductive adhesive offers excellent reworkability at 80-150°C and is storable at-40°C for one year. TK7758 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing

TP 7855 is an alumina crystrallites filled, electrically insulating, medium bond strength thermoplastic film adhesive. It is designed for bonding component and substrate. TP 7855 has good thermal conductivity. The dry, tack free handling of this film makes it suitable for an automated assembly. This high purity adhesive possesses excellent moisture resistance.